CoSn<sub>3</sub> Intermetallic Nanoparticles for Electronic Packaging

CoSn<sub>3</sub> Intermetallic Nanoparticles for Electronic Packaging

At present, composite solder pastes are getting a lot of attention, especially composite Sn based solders reinforced by nanoparticles. Indeed, CoSn<sub>3</sub> is a strong nucleating agent of Sn crystal, which has potential application value in the field of electronic packaging. However,...

Full description

Bibliographic Details
Main Authors: Jintao Wang, Ziwen Lv, Luobin Zhang, Fangcheng Duan, Weiwei Zhang, Hongtao Chen
Format: Article
Language:English
Published: MDPI AG 2022-11-01
Series:Nanomaterials
Subjects:
solder
intermetallic
TEM
CoSn<sub>3</sub> nanoparticles
chemical reduction
Online Access:https://www.mdpi.com/2079-4991/12/22/4083

Similar Items

Similar Items