Application of Hot-wire Method for Measuring Thermal Conductivity of Fine Ceramics
<p>Ceramic substrate is preferred in high density packaging due to its high electrical resistivity and moderate expansion coefficient. The thermal conductivity is a key parameter for packaging substrates. There are two common methods to measure the thermal conductivity, which are the hot-wire...
Main Authors: | Shangxi WANG, Dan ZHANG, Gaoshan LIU, Wenjun WANG, Mengxia HU |
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Format: | Article |
Language: | English |
Published: |
Kaunas University of Technology
2016-11-01
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Series: | Medžiagotyra |
Subjects: | |
Online Access: | http://matsc.ktu.lt/index.php/MatSc/article/view/12543 |
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