An effective approach for identifying defective critical fabrication path

Most defect signatures on wafers are caused by faulty tools. If these defects are not captured by in-line inspection tools or sampled during Defect Review-SEM, they are carried over multiple processing steps and discovered at the end of the fabrication procedure. Wafers with different defect signatu...

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Bibliographic Details
Main Author: Kamal Taha
Format: Article
Language:English
Published: Taylor & Francis Group 2019-01-01
Series:Cogent Engineering
Subjects:
Online Access:http://dx.doi.org/10.1080/23311916.2019.1575636

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