An effective approach for identifying defective critical fabrication path
Most defect signatures on wafers are caused by faulty tools. If these defects are not captured by in-line inspection tools or sampled during Defect Review-SEM, they are carried over multiple processing steps and discovered at the end of the fabrication procedure. Wafers with different defect signatu...
Main Author: | Kamal Taha |
---|---|
Format: | Article |
Language: | English |
Published: |
Taylor & Francis Group
2019-01-01
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Series: | Cogent Engineering |
Subjects: | |
Online Access: | http://dx.doi.org/10.1080/23311916.2019.1575636 |
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