Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments
High-temperature-resistant polymeric adhesives with high servicing temperatures and high adhesion strengths are highly desired in aerospace, aviation, microelectronic and other high-tech areas. The currently used high-temperature resistant polymeric adhesives, such as polyamic acid (PAA), are usuall...
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MDPI AG
2021-06-01
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| Series: | Nanomaterials |
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| Online Access: | https://www.mdpi.com/2079-4991/11/6/1525 |
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| author | Hao-ran Qi Deng-xiong Shen Yan-jiang Jia Yuan-cheng An Hao Wu Xin-ying Wei Yan Zhang Xin-xin Zhi Jin-gang Liu |
| author_facet | Hao-ran Qi Deng-xiong Shen Yan-jiang Jia Yuan-cheng An Hao Wu Xin-ying Wei Yan Zhang Xin-xin Zhi Jin-gang Liu |
| author_sort | Hao-ran Qi |
| collection | DOAJ |
| description | High-temperature-resistant polymeric adhesives with high servicing temperatures and high adhesion strengths are highly desired in aerospace, aviation, microelectronic and other high-tech areas. The currently used high-temperature resistant polymeric adhesives, such as polyamic acid (PAA), are usually made from the high contents of solvents in the composition, which might cause adhesion failure due to the undesirable voids caused by the evaporation of the solvents. In the current work, electrospun preimidized polyimide (PI) nano-fibrous membranes (NFMs) were proposed to be used as solvent-free or solvent-less adhesives for stainless steel adhesion. In order to enhance the adhesion reliability of the PI NFMs, thermally crosslinkable phenylethynyl end-cappers were incorporated into the PIs derived from 3,3’,4,4’-oxydiphthalic anhydride (ODPA) and 3,3-bis[4-(4-aminophenoxy)phenyl]phthalide (BAPPT). The derived phenylethynyl-terminated PETI-10K and PETI-20K with the controlled molecular weights of 10,000 g mol<sup>−1</sup> and 20,000 g mol<sup>−1</sup>, respectively, showed good solubility in polar aprotic solvents, such as <i>N</i>-methyl-2-pyrrolidinone (NMP) and <i>N,N</i>-dimethylacetamide (DMAc). The PI NFMs were successfully fabricated by electrospinning with the PETI/DMAc solutions. The ultrafine PETI NFMs showed the average fiber diameters (<i>d</i><sub>av</sub>) of 627 nm for PETI-10K 695 nm for PETI-20K, respectively. The PETI NFMs showed good thermal resistance, which is reflected in the glass transition temperatures (<i>T</i><sub>g</sub>s) above 270 °C. The PETI NFMs exhibited excellent thermoplasticity at elevated temperatures. The stainless steel adherends were successfully adhered using the PETI NFMs as the adhesives. The PI NFMs provided good adhesion to the stainless steels with the single lap shear strengths (LSS) higher than 20.0 MPa either at room temperature (25 °C) or at an elevated temperature (200 °C). |
| first_indexed | 2024-03-10T10:33:50Z |
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| id | doaj.art-177f7a89f9bc4aa8afed0eee5da782a5 |
| institution | Directory Open Access Journal |
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| language | English |
| last_indexed | 2024-03-10T10:33:50Z |
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| spelling | doaj.art-177f7a89f9bc4aa8afed0eee5da782a52023-11-21T23:23:54ZengMDPI AGNanomaterials2079-49912021-06-01116152510.3390/nano11061525Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh EnvironmentsHao-ran Qi0Deng-xiong Shen1Yan-jiang Jia2Yuan-cheng An3Hao Wu4Xin-ying Wei5Yan Zhang6Xin-xin Zhi7Jin-gang Liu8School of Materials Science and Technology, China University of Geosciences, Beijing 100083, ChinaAerospace Research Institute of Materials& Processing Technology, Beijing 100076, ChinaSchool of Materials Science and Technology, China University of Geosciences, Beijing 100083, ChinaSchool of Materials Science and Technology, China University of Geosciences, Beijing 100083, ChinaSchool of Materials Science and Technology, China University of Geosciences, Beijing 100083, ChinaSchool of Materials Science and Technology, China University of Geosciences, Beijing 100083, ChinaSchool of Materials Science and Technology, China University of Geosciences, Beijing 100083, ChinaSchool of Materials Science and Technology, China University of Geosciences, Beijing 100083, ChinaSchool of Materials Science and Technology, China University of Geosciences, Beijing 100083, ChinaHigh-temperature-resistant polymeric adhesives with high servicing temperatures and high adhesion strengths are highly desired in aerospace, aviation, microelectronic and other high-tech areas. The currently used high-temperature resistant polymeric adhesives, such as polyamic acid (PAA), are usually made from the high contents of solvents in the composition, which might cause adhesion failure due to the undesirable voids caused by the evaporation of the solvents. In the current work, electrospun preimidized polyimide (PI) nano-fibrous membranes (NFMs) were proposed to be used as solvent-free or solvent-less adhesives for stainless steel adhesion. In order to enhance the adhesion reliability of the PI NFMs, thermally crosslinkable phenylethynyl end-cappers were incorporated into the PIs derived from 3,3’,4,4’-oxydiphthalic anhydride (ODPA) and 3,3-bis[4-(4-aminophenoxy)phenyl]phthalide (BAPPT). The derived phenylethynyl-terminated PETI-10K and PETI-20K with the controlled molecular weights of 10,000 g mol<sup>−1</sup> and 20,000 g mol<sup>−1</sup>, respectively, showed good solubility in polar aprotic solvents, such as <i>N</i>-methyl-2-pyrrolidinone (NMP) and <i>N,N</i>-dimethylacetamide (DMAc). The PI NFMs were successfully fabricated by electrospinning with the PETI/DMAc solutions. The ultrafine PETI NFMs showed the average fiber diameters (<i>d</i><sub>av</sub>) of 627 nm for PETI-10K 695 nm for PETI-20K, respectively. The PETI NFMs showed good thermal resistance, which is reflected in the glass transition temperatures (<i>T</i><sub>g</sub>s) above 270 °C. The PETI NFMs exhibited excellent thermoplasticity at elevated temperatures. The stainless steel adherends were successfully adhered using the PETI NFMs as the adhesives. The PI NFMs provided good adhesion to the stainless steels with the single lap shear strengths (LSS) higher than 20.0 MPa either at room temperature (25 °C) or at an elevated temperature (200 °C).https://www.mdpi.com/2079-4991/11/6/1525polyimidenano-fibrous membraneelectrospinningadhesiveslap shear strength |
| spellingShingle | Hao-ran Qi Deng-xiong Shen Yan-jiang Jia Yuan-cheng An Hao Wu Xin-ying Wei Yan Zhang Xin-xin Zhi Jin-gang Liu Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments Nanomaterials polyimide nano-fibrous membrane electrospinning adhesives lap shear strength |
| title | Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments |
| title_full | Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments |
| title_fullStr | Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments |
| title_full_unstemmed | Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments |
| title_short | Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments |
| title_sort | preparation and properties of electrospun phenylethynyl terminated polyimide nano fibrous membranes with potential applications as solvent free and high temperature resistant adhesives for harsh environments |
| topic | polyimide nano-fibrous membrane electrospinning adhesives lap shear strength |
| url | https://www.mdpi.com/2079-4991/11/6/1525 |
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