Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

Preparation and Properties of Electrospun Phenylethynyl—Terminated Polyimide Nano-Fibrous Membranes with Potential Applications as Solvent-Free and High-Temperature Resistant Adhesives for Harsh Environments

High-temperature-resistant polymeric adhesives with high servicing temperatures and high adhesion strengths are highly desired in aerospace, aviation, microelectronic and other high-tech areas. The currently used high-temperature resistant polymeric adhesives, such as polyamic acid (PAA), are usuall...

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Bibliographic Details
Main Authors: Hao-ran Qi, Deng-xiong Shen, Yan-jiang Jia, Yuan-cheng An, Hao Wu, Xin-ying Wei, Yan Zhang, Xin-xin Zhi, Jin-gang Liu
Format: Article
Language:English
Published: MDPI AG 2021-06-01
Series:Nanomaterials
Subjects:
polyimide
nano-fibrous membrane
electrospinning
adhesives
lap shear strength
Online Access:https://www.mdpi.com/2079-4991/11/6/1525

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