ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES
Using nonstationary regimes electrolysis for electrodepositing silver solder bump semiconductor blocked has reduced lateral expansion of different height on the plate, to improve the qualitative characteristics of the product, increase the number of devices produced on a semiconductor wafer, and the...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | Russian |
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Educational institution «Belarusian State University of Informatics and Radioelectronics»
2019-06-01
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| Series: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| Subjects: | |
| Online Access: | https://doklady.bsuir.by/jour/article/view/248 |
| _version_ | 1797881195908825088 |
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| author | A. A. Khmyl I. I. Kuzmar L. K. Kushner N. V. Bogush M. M. Borisik S. M. Zavadski |
| author_facet | A. A. Khmyl I. I. Kuzmar L. K. Kushner N. V. Bogush M. M. Borisik S. M. Zavadski |
| author_sort | A. A. Khmyl |
| collection | DOAJ |
| description | Using nonstationary regimes electrolysis for electrodepositing silver solder bump semiconductor blocked has reduced lateral expansion of different height on the plate, to improve the qualitative characteristics of the product, increase the number of devices produced on a semiconductor wafer, and thereby improve process performance and achieve economies of precious metals. |
| first_indexed | 2024-04-10T03:15:08Z |
| format | Article |
| id | doaj.art-17d0d1032ab0463c8d49b363a416a742 |
| institution | Directory Open Access Journal |
| issn | 1729-7648 |
| language | Russian |
| last_indexed | 2024-04-10T03:15:08Z |
| publishDate | 2019-06-01 |
| publisher | Educational institution «Belarusian State University of Informatics and Radioelectronics» |
| record_format | Article |
| series | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| spelling | doaj.art-17d0d1032ab0463c8d49b363a416a7422023-03-13T07:33:12ZrusEducational institution «Belarusian State University of Informatics and Radioelectronics»Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki1729-76482019-06-01081622247ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICESA. A. Khmyl0I. I. Kuzmar1L. K. Kushner2N. V. Bogush3M. M. Borisik4S. M. Zavadski5Белорусский государственный университет информатики и радиоэлектроникиБелорусский государственный университет информатики и радиоэлектроникиБелорусский государственный университет информатики и радиоэлектроникиБелорусский государственный университет информатики и радиоэлектроникиБелорусский государственный университет информатики и радиоэлектроникиБелорусский государственный университет информатики и радиоэлектроникиUsing nonstationary regimes electrolysis for electrodepositing silver solder bump semiconductor blocked has reduced lateral expansion of different height on the plate, to improve the qualitative characteristics of the product, increase the number of devices produced on a semiconductor wafer, and thereby improve process performance and achieve economies of precious metals.https://doklady.bsuir.by/jour/article/view/248серебряные электрохимические покрытиянестационарный электролизобъемные (столбиковые) выводы |
| spellingShingle | A. A. Khmyl I. I. Kuzmar L. K. Kushner N. V. Bogush M. M. Borisik S. M. Zavadski ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki серебряные электрохимические покрытия нестационарный электролиз объемные (столбиковые) выводы |
| title | ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES |
| title_full | ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES |
| title_fullStr | ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES |
| title_full_unstemmed | ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES |
| title_short | ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES |
| title_sort | electrodeposition of solder bump to semiconductor devices |
| topic | серебряные электрохимические покрытия нестационарный электролиз объемные (столбиковые) выводы |
| url | https://doklady.bsuir.by/jour/article/view/248 |
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