Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature
In this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating conditions (130 °C and 180 °C) and current densities (different cr...
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-12-01
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| Series: | Applied Sciences |
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| Online Access: | https://www.mdpi.com/2076-3417/10/24/8893 |
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| author | Zhao-Ying Wang Nhat Minh Dang Po-Hsun Wang Terry Yuan-Fang Chen Ming-Tzer Lin |
| author_facet | Zhao-Ying Wang Nhat Minh Dang Po-Hsun Wang Terry Yuan-Fang Chen Ming-Tzer Lin |
| author_sort | Zhao-Ying Wang |
| collection | DOAJ |
| description | In this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating conditions (130 °C and 180 °C) and current densities (different cross-sectional areas). The micro-structural changes and intermetallic compound (IMC) formation were observed, and failure phenomena (brittle cracks, voids, bumps, etc.) on the structures of samples were discussed. The results showed that the IMC thickness increased as the temperature and current density increased. Moreover, it was found that the higher the temperature and current density was, the greater the defects that were observed. By adjusting the designs of sample structures, the stress from the current density can be decreased, resulting in reduced failure phenomena, such as signal delay, distortion, and short circuiting after long-term use of the material components. A detailed IMC growth mechanism and defect formation were also closely studied and discussed. |
| first_indexed | 2024-03-10T14:06:35Z |
| format | Article |
| id | doaj.art-17f7b28fe0124018b788f6a3f161f8e0 |
| institution | Directory Open Access Journal |
| issn | 2076-3417 |
| language | English |
| last_indexed | 2024-03-10T14:06:35Z |
| publishDate | 2020-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Applied Sciences |
| spelling | doaj.art-17f7b28fe0124018b788f6a3f161f8e02023-11-21T00:35:27ZengMDPI AGApplied Sciences2076-34172020-12-011024889310.3390/app10248893Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and TemperatureZhao-Ying Wang0Nhat Minh Dang1Po-Hsun Wang2Terry Yuan-Fang Chen3Ming-Tzer Lin4Graduate Institute of Precision Engineering, National Chung Hsing University, Taichung City 40227, TaiwanGraduate Institute of Precision Engineering, National Chung Hsing University, Taichung City 40227, TaiwanGraduate Institute of Precision Engineering, National Chung Hsing University, Taichung City 40227, TaiwanDepartment of Mechanical Engineering, National Cheng Kung University, Tainan City 701, TaiwanGraduate Institute of Precision Engineering, National Chung Hsing University, Taichung City 40227, TaiwanIn this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating conditions (130 °C and 180 °C) and current densities (different cross-sectional areas). The micro-structural changes and intermetallic compound (IMC) formation were observed, and failure phenomena (brittle cracks, voids, bumps, etc.) on the structures of samples were discussed. The results showed that the IMC thickness increased as the temperature and current density increased. Moreover, it was found that the higher the temperature and current density was, the greater the defects that were observed. By adjusting the designs of sample structures, the stress from the current density can be decreased, resulting in reduced failure phenomena, such as signal delay, distortion, and short circuiting after long-term use of the material components. A detailed IMC growth mechanism and defect formation were also closely studied and discussed.https://www.mdpi.com/2076-3417/10/24/8893electromigrationintermetallic compoundcurrent density |
| spellingShingle | Zhao-Ying Wang Nhat Minh Dang Po-Hsun Wang Terry Yuan-Fang Chen Ming-Tzer Lin Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature Applied Sciences electromigration intermetallic compound current density |
| title | Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature |
| title_full | Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature |
| title_fullStr | Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature |
| title_full_unstemmed | Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature |
| title_short | Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature |
| title_sort | study on electromigration effects and imc formation on cu sn films due to current stress and temperature |
| topic | electromigration intermetallic compound current density |
| url | https://www.mdpi.com/2076-3417/10/24/8893 |
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