Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature

Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature

In this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating conditions (130 °C and 180 °C) and current densities (different cr...

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Bibliographic Details
Main Authors: Zhao-Ying Wang, Nhat Minh Dang, Po-Hsun Wang, Terry Yuan-Fang Chen, Ming-Tzer Lin
Format: Article
Language:English
Published: MDPI AG 2020-12-01
Series:Applied Sciences
Subjects:
electromigration
intermetallic compound
current density
Online Access:https://www.mdpi.com/2076-3417/10/24/8893

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