Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere
This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-03-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/16/6/2389 |
| _version_ | 1797610418902925312 |
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| author | Siliang He Bifu Xiong Fangyi Xu Biyang Chen Yinhua Cui Chuan Hu Gao Yue Yu-An Shen |
| author_facet | Siliang He Bifu Xiong Fangyi Xu Biyang Chen Yinhua Cui Chuan Hu Gao Yue Yu-An Shen |
| author_sort | Siliang He |
| collection | DOAJ |
| description | This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of intermetallic compounds with high melting point at low temperatures. The present paper investigates the effects of bonding atmosphere, bonding time, and external pressure on the shear strength of metal joints. Under formic acid (FA) atmosphere, Cu<sub>6</sub>Sn<sub>5</sub> forms at the porous Cu foil/Sn58Bi interface, and some of it transforms into Cu<sub>3</sub>Sn. External pressure significantly reduces the micropores and thickness of the joint interconnection layer, resulting in a ductile fracture failure mode. The metal joint obtained under a pressure of 10 MPa at 250 °C for 5 min exhibits outstanding bonding mechanical performance with a shear strength of 62.2 MPa. |
| first_indexed | 2024-03-11T06:14:59Z |
| format | Article |
| id | doaj.art-18dab59f66d34cefbe963565dea5b209 |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-11T06:14:59Z |
| publishDate | 2023-03-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-18dab59f66d34cefbe963565dea5b2092023-11-17T12:21:36ZengMDPI AGMaterials1996-19442023-03-01166238910.3390/ma16062389Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid AtmosphereSiliang He0Bifu Xiong1Fangyi Xu2Biyang Chen3Yinhua Cui4Chuan Hu5Gao Yue6Yu-An Shen7Guangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, ChinaGuangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, ChinaGuangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, ChinaGuangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, ChinaInstitute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, ChinaInstitute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, ChinaGuangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, ChinaDepartment of Materials Science and Engineering, Feng Chia University, Taichung 407, TaiwanThis study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of intermetallic compounds with high melting point at low temperatures. The present paper investigates the effects of bonding atmosphere, bonding time, and external pressure on the shear strength of metal joints. Under formic acid (FA) atmosphere, Cu<sub>6</sub>Sn<sub>5</sub> forms at the porous Cu foil/Sn58Bi interface, and some of it transforms into Cu<sub>3</sub>Sn. External pressure significantly reduces the micropores and thickness of the joint interconnection layer, resulting in a ductile fracture failure mode. The metal joint obtained under a pressure of 10 MPa at 250 °C for 5 min exhibits outstanding bonding mechanical performance with a shear strength of 62.2 MPa.https://www.mdpi.com/1996-1944/16/6/2389TLP bondingporous Cuformic acidsolderingintermetallic compounds |
| spellingShingle | Siliang He Bifu Xiong Fangyi Xu Biyang Chen Yinhua Cui Chuan Hu Gao Yue Yu-An Shen Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere Materials TLP bonding porous Cu formic acid soldering intermetallic compounds |
| title | Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere |
| title_full | Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere |
| title_fullStr | Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere |
| title_full_unstemmed | Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere |
| title_short | Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere |
| title_sort | low temperature transient liquid phase bonding technology via cu porous sn58bi solid liquid system under formic acid atmosphere |
| topic | TLP bonding porous Cu formic acid soldering intermetallic compounds |
| url | https://www.mdpi.com/1996-1944/16/6/2389 |
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