Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of...

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Bibliographic Details
Main Authors:	Siliang He, Bifu Xiong, Fangyi Xu, Biyang Chen, Yinhua Cui, Chuan Hu, Gao Yue, Yu-An Shen
Format:	Article
Language:	English
Published:	MDPI AG 2023-03-01
Series:	Materials
Subjects:	TLP bonding porous Cu formic acid soldering intermetallic compounds
Online Access:	https://www.mdpi.com/1996-1944/16/6/2389

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