Cu Direct Nanopatterning Using Solid‐State Electrochemical Dissolution at the Anode/Polymer Electrolyte Membrane Interface
Abstract Patterned copper (Cu) has applications in various electronic devices such as metal interconnects. Electrochemical approaches to patterning, such as electrochemical machining and electroplating, are promising methods for the direct fabrication of patterns on Cu surfaces. However, owing to th...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley-VCH
2024-03-01
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| Series: | Advanced Materials Interfaces |
| Subjects: | |
| Online Access: | https://doi.org/10.1002/admi.202300896 |