A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces
This paper proposes a real-time thermal monitoring method using embedded integrated sensor interfaces dedicated to industrial integrated system applications. Industrial sensor interfaces are complex systems that involve analog and mixed signals, where several parameters can influence their performan...
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-10-01
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| Series: | Sensors |
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| Online Access: | https://www.mdpi.com/1424-8220/20/19/5657 |
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| author | Ouafaa Ettahri Aziz Oukaira Mohamed Ali Ahmad Hassan Morteza Nabavi Yvon Savaria Ahmed Lakhssassi |
| author_facet | Ouafaa Ettahri Aziz Oukaira Mohamed Ali Ahmad Hassan Morteza Nabavi Yvon Savaria Ahmed Lakhssassi |
| author_sort | Ouafaa Ettahri |
| collection | DOAJ |
| description | This paper proposes a real-time thermal monitoring method using embedded integrated sensor interfaces dedicated to industrial integrated system applications. Industrial sensor interfaces are complex systems that involve analog and mixed signals, where several parameters can influence their performance. These include the presence of heat sources near sensitive integrated circuits, and various heat transfer phenomena need to be considered. This creates a need for real-time thermal monitoring and management. Indeed, the control of transient temperature gradients or temperature differential variations as well as the prediction of possible induced thermal shocks and stress at early design phases of advanced integrated circuits and systems are essential. This paper addresses the growing requirements of microelectronics applications in several areas that experience fast variations in high-power density and thermal gradient differences caused by the implementation of different systems on the same chip, such as the new-generation 5G circuits. To mitigate adverse thermal effects, a real-time prediction algorithm is proposed and validated using the MCUXpresso tool applied to a Freescale embedded sensor board to monitor and predict its temperature profile in real time by programming the embedded sensor into the FRDM-KL26Z board. Based on discrete temperature measurements, the embedded system is used to predict, in advance, overheating situations in the embedded integrated circuit (IC). These results confirm the peak detection capability of the proposed algorithm that satisfactorily predicts thermal peaks in the FRDM-KL26Z board as modeled with a finite element thermal analysis tool (the Numerical Integrated elements for System Analysis (NISA) tool), to gauge the level of local thermomechanical stresses that may be induced. In this paper, the FPGA implementation and comparison measurements are also presented. This work provides a solution to the thermal stresses and local system overheating that have been a major concern for integrated sensor interface designers when designing integrated circuits in various high-performance technologies or harsh environments. |
| first_indexed | 2024-03-10T15:51:28Z |
| format | Article |
| id | doaj.art-1a2950aaa65b406f84b7a63820d59e80 |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2024-03-10T15:51:28Z |
| publishDate | 2020-10-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-1a2950aaa65b406f84b7a63820d59e802023-11-20T15:58:04ZengMDPI AGSensors1424-82202020-10-012019565710.3390/s20195657A Real-Time Thermal Monitoring System Intended for Embedded Sensors InterfacesOuafaa Ettahri0Aziz Oukaira1Mohamed Ali2Ahmad Hassan3Morteza Nabavi4Yvon Savaria5Ahmed Lakhssassi6Department of Engineering Computer Science, University of Québec in Outaouais, Gatineau, QC 18X 3X7, CanadaDepartment of Engineering Computer Science, University of Québec in Outaouais, Gatineau, QC 18X 3X7, CanadaElectrical Engineering Department, Polytechnique Montréal, Montréal, QC H3T 1J4, CanadaElectrical Engineering Department, Polytechnique Montréal, Montréal, QC H3T 1J4, CanadaElectrical Engineering Department, Polytechnique Montréal, Montréal, QC H3T 1J4, CanadaElectrical Engineering Department, Polytechnique Montréal, Montréal, QC H3T 1J4, CanadaDepartment of Engineering Computer Science, University of Québec in Outaouais, Gatineau, QC 18X 3X7, CanadaThis paper proposes a real-time thermal monitoring method using embedded integrated sensor interfaces dedicated to industrial integrated system applications. Industrial sensor interfaces are complex systems that involve analog and mixed signals, where several parameters can influence their performance. These include the presence of heat sources near sensitive integrated circuits, and various heat transfer phenomena need to be considered. This creates a need for real-time thermal monitoring and management. Indeed, the control of transient temperature gradients or temperature differential variations as well as the prediction of possible induced thermal shocks and stress at early design phases of advanced integrated circuits and systems are essential. This paper addresses the growing requirements of microelectronics applications in several areas that experience fast variations in high-power density and thermal gradient differences caused by the implementation of different systems on the same chip, such as the new-generation 5G circuits. To mitigate adverse thermal effects, a real-time prediction algorithm is proposed and validated using the MCUXpresso tool applied to a Freescale embedded sensor board to monitor and predict its temperature profile in real time by programming the embedded sensor into the FRDM-KL26Z board. Based on discrete temperature measurements, the embedded system is used to predict, in advance, overheating situations in the embedded integrated circuit (IC). These results confirm the peak detection capability of the proposed algorithm that satisfactorily predicts thermal peaks in the FRDM-KL26Z board as modeled with a finite element thermal analysis tool (the Numerical Integrated elements for System Analysis (NISA) tool), to gauge the level of local thermomechanical stresses that may be induced. In this paper, the FPGA implementation and comparison measurements are also presented. This work provides a solution to the thermal stresses and local system overheating that have been a major concern for integrated sensor interface designers when designing integrated circuits in various high-performance technologies or harsh environments.https://www.mdpi.com/1424-8220/20/19/5657thermal monitoringindustrial embedded applicationssensor interfaceheat sourcesFRDM-KL26ZIC |
| spellingShingle | Ouafaa Ettahri Aziz Oukaira Mohamed Ali Ahmad Hassan Morteza Nabavi Yvon Savaria Ahmed Lakhssassi A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces Sensors thermal monitoring industrial embedded applications sensor interface heat sources FRDM-KL26Z IC |
| title | A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces |
| title_full | A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces |
| title_fullStr | A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces |
| title_full_unstemmed | A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces |
| title_short | A Real-Time Thermal Monitoring System Intended for Embedded Sensors Interfaces |
| title_sort | real time thermal monitoring system intended for embedded sensors interfaces |
| topic | thermal monitoring industrial embedded applications sensor interface heat sources FRDM-KL26Z IC |
| url | https://www.mdpi.com/1424-8220/20/19/5657 |
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