Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening Systems
Thermosetting polymers are used in building materials, for example adhesives in fastening systems. They harden in environmental conditions with a daily temperature depending on the season and location. This curing process takes hours or even days effected by the relatively low ambient temperature ne...
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MDPI AG
2021-07-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/14/14/3853 |
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| author | Bilen Emek Abali Michele Zecchini Gilda Daissè Ivana Czabany Wolfgang Gindl-Altmutter Roman Wan-Wendner |
| author_facet | Bilen Emek Abali Michele Zecchini Gilda Daissè Ivana Czabany Wolfgang Gindl-Altmutter Roman Wan-Wendner |
| author_sort | Bilen Emek Abali |
| collection | DOAJ |
| description | Thermosetting polymers are used in building materials, for example adhesives in fastening systems. They harden in environmental conditions with a daily temperature depending on the season and location. This curing process takes hours or even days effected by the relatively low ambient temperature necessary for a fast and complete curing. As material properties depend on the degree of cure, its accurate estimation is of paramount interest and the main objective in this work. Thus, we develop an approach for modeling the curing process for epoxy based thermosetting polymers. Specifically, we perform experiments and demonstrate an inverse analysis for determining parameters in the curing model. By using calorimetry measurements and implementing an inverse analysis algorithm by using open-source packages, we obtain 10 material parameters describing the curing process. We present the methodology for two commercial, epoxy based products, where a statistical analysis provides independence of material parameters leading to the conclusion that the material equation is adequately describing the material response. |
| first_indexed | 2024-03-10T09:33:06Z |
| format | Article |
| id | doaj.art-1a300a72342f46b4bc272d87439f1464 |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-10T09:33:06Z |
| publishDate | 2021-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-1a300a72342f46b4bc272d87439f14642023-11-22T04:15:47ZengMDPI AGMaterials1996-19442021-07-011414385310.3390/ma14143853Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening SystemsBilen Emek Abali0Michele Zecchini1Gilda Daissè2Ivana Czabany3Wolfgang Gindl-Altmutter4Roman Wan-Wendner5Division of Applied Mechanics, Department of Materials Science and Engineering, Uppsala University, P.O. Box 534, SE-751 21 Uppsala, SwedenChristian Doppler Laboratory LiCRoFast, University of Natural Resources and Life Sciences, Peter-Jordan-Straße 82, 1190 Vienna, AustriaChristian Doppler Laboratory LiCRoFast, University of Natural Resources and Life Sciences, Peter-Jordan-Straße 82, 1190 Vienna, AustriaInstitute of Wood Technology and Renewable Materials, Department of Material Science and Process Engineering, BOKU University of Natural Resources and Life Sciences, Konrad-Lorenz-Straße 24, 3430 Tulln, AustriaInstitute of Wood Technology and Renewable Materials, Department of Material Science and Process Engineering, BOKU University of Natural Resources and Life Sciences, Konrad-Lorenz-Straße 24, 3430 Tulln, AustriaChristian Doppler Laboratory LiCRoFast, University of Natural Resources and Life Sciences, Peter-Jordan-Straße 82, 1190 Vienna, AustriaThermosetting polymers are used in building materials, for example adhesives in fastening systems. They harden in environmental conditions with a daily temperature depending on the season and location. This curing process takes hours or even days effected by the relatively low ambient temperature necessary for a fast and complete curing. As material properties depend on the degree of cure, its accurate estimation is of paramount interest and the main objective in this work. Thus, we develop an approach for modeling the curing process for epoxy based thermosetting polymers. Specifically, we perform experiments and demonstrate an inverse analysis for determining parameters in the curing model. By using calorimetry measurements and implementing an inverse analysis algorithm by using open-source packages, we obtain 10 material parameters describing the curing process. We present the methodology for two commercial, epoxy based products, where a statistical analysis provides independence of material parameters leading to the conclusion that the material equation is adequately describing the material response.https://www.mdpi.com/1996-1944/14/14/3853thermosetscuring kineticscalorimetryinverse analysismaterial parameters |
| spellingShingle | Bilen Emek Abali Michele Zecchini Gilda Daissè Ivana Czabany Wolfgang Gindl-Altmutter Roman Wan-Wendner Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening Systems Materials thermosets curing kinetics calorimetry inverse analysis material parameters |
| title | Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening Systems |
| title_full | Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening Systems |
| title_fullStr | Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening Systems |
| title_full_unstemmed | Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening Systems |
| title_short | Cure Kinetics and Inverse Analysis of Epoxy-Amine Based Adhesive Used for Fastening Systems |
| title_sort | cure kinetics and inverse analysis of epoxy amine based adhesive used for fastening systems |
| topic | thermosets curing kinetics calorimetry inverse analysis material parameters |
| url | https://www.mdpi.com/1996-1944/14/14/3853 |
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