Using machine learning with optical profilometry for GaN wafer screening

Abstract To improve the manufacturing process of GaN wafers, inexpensive wafer screening techniques are required to both provide feedback to the manufacturing process and prevent fabrication on low quality or defective wafers, thus reducing costs resulting from wasted processing effort. Many of the...

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Main Authors: James C. Gallagher, Michael A. Mastro, Mona A. Ebrish, Alan G. Jacobs, Brendan P. Gunning, Robert J. Kaplar, Karl D. Hobart, Travis J. Anderson
Format: Article
Language:English
Published: Nature Portfolio 2023-02-01
Series:Scientific Reports
Online Access:https://doi.org/10.1038/s41598-023-29107-9
_version_ 1797864962715025408
author James C. Gallagher
Michael A. Mastro
Mona A. Ebrish
Alan G. Jacobs
Brendan P. Gunning
Robert J. Kaplar
Karl D. Hobart
Travis J. Anderson
author_facet James C. Gallagher
Michael A. Mastro
Mona A. Ebrish
Alan G. Jacobs
Brendan P. Gunning
Robert J. Kaplar
Karl D. Hobart
Travis J. Anderson
author_sort James C. Gallagher
collection DOAJ
description Abstract To improve the manufacturing process of GaN wafers, inexpensive wafer screening techniques are required to both provide feedback to the manufacturing process and prevent fabrication on low quality or defective wafers, thus reducing costs resulting from wasted processing effort. Many of the wafer scale characterization techniques—including optical profilometry—produce difficult to interpret results, while models using classical programming techniques require laborious translation of the human-generated data interpretation methodology. Alternatively, machine learning techniques are effective at producing such models if sufficient data is available. For this research project, we fabricated over 6000 vertical PiN GaN diodes across 10 wafers. Using low resolution wafer scale optical profilometry data taken before fabrication, we successfully trained four different machine learning models. All models predict device pass and fail with 70–75% accuracy, and the wafer yield can be predicted within 15% error on the majority of wafers.
first_indexed 2024-04-09T23:00:19Z
format Article
id doaj.art-1ac3926697a74e94a44d8726bab50e74
institution Directory Open Access Journal
issn 2045-2322
language English
last_indexed 2024-04-09T23:00:19Z
publishDate 2023-02-01
publisher Nature Portfolio
record_format Article
series Scientific Reports
spelling doaj.art-1ac3926697a74e94a44d8726bab50e742023-03-22T10:59:31ZengNature PortfolioScientific Reports2045-23222023-02-0113111110.1038/s41598-023-29107-9Using machine learning with optical profilometry for GaN wafer screeningJames C. Gallagher0Michael A. Mastro1Mona A. Ebrish2Alan G. Jacobs3Brendan P. Gunning4Robert J. Kaplar5Karl D. Hobart6Travis J. Anderson7U.S. Naval Research LaboratoryU.S. Naval Research LaboratoryNRC Postdoc Fellow Residing at the U.S. Naval Research LaboratoryU.S. Naval Research LaboratorySandia National LaboratoriesSandia National LaboratoriesU.S. Naval Research LaboratoryU.S. Naval Research LaboratoryAbstract To improve the manufacturing process of GaN wafers, inexpensive wafer screening techniques are required to both provide feedback to the manufacturing process and prevent fabrication on low quality or defective wafers, thus reducing costs resulting from wasted processing effort. Many of the wafer scale characterization techniques—including optical profilometry—produce difficult to interpret results, while models using classical programming techniques require laborious translation of the human-generated data interpretation methodology. Alternatively, machine learning techniques are effective at producing such models if sufficient data is available. For this research project, we fabricated over 6000 vertical PiN GaN diodes across 10 wafers. Using low resolution wafer scale optical profilometry data taken before fabrication, we successfully trained four different machine learning models. All models predict device pass and fail with 70–75% accuracy, and the wafer yield can be predicted within 15% error on the majority of wafers.https://doi.org/10.1038/s41598-023-29107-9
spellingShingle James C. Gallagher
Michael A. Mastro
Mona A. Ebrish
Alan G. Jacobs
Brendan P. Gunning
Robert J. Kaplar
Karl D. Hobart
Travis J. Anderson
Using machine learning with optical profilometry for GaN wafer screening
Scientific Reports
title Using machine learning with optical profilometry for GaN wafer screening
title_full Using machine learning with optical profilometry for GaN wafer screening
title_fullStr Using machine learning with optical profilometry for GaN wafer screening
title_full_unstemmed Using machine learning with optical profilometry for GaN wafer screening
title_short Using machine learning with optical profilometry for GaN wafer screening
title_sort using machine learning with optical profilometry for gan wafer screening
url https://doi.org/10.1038/s41598-023-29107-9
work_keys_str_mv AT jamescgallagher usingmachinelearningwithopticalprofilometryforganwaferscreening
AT michaelamastro usingmachinelearningwithopticalprofilometryforganwaferscreening
AT monaaebrish usingmachinelearningwithopticalprofilometryforganwaferscreening
AT alangjacobs usingmachinelearningwithopticalprofilometryforganwaferscreening
AT brendanpgunning usingmachinelearningwithopticalprofilometryforganwaferscreening
AT robertjkaplar usingmachinelearningwithopticalprofilometryforganwaferscreening
AT karldhobart usingmachinelearningwithopticalprofilometryforganwaferscreening
AT travisjanderson usingmachinelearningwithopticalprofilometryforganwaferscreening