High-throughput study of the effect of indium on the microstructure and properties of copper alloy
In this work, the high throughput sample of Cu-xIn (x = 0–5 wt.%) alloy was prepared by the spark plasma sintering. The effects of In content on the microstructure and properties of Cu alloys were investigated using advanced characterization. The results show that the concentration of In element lin...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423025152 |
| _version_ | 1827346114701950976 |
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| author | Jiaoyan Dai Chengpeng Liu Shuaiqi Fan Xiang-Xi Ye |
| author_facet | Jiaoyan Dai Chengpeng Liu Shuaiqi Fan Xiang-Xi Ye |
| author_sort | Jiaoyan Dai |
| collection | DOAJ |
| description | In this work, the high throughput sample of Cu-xIn (x = 0–5 wt.%) alloy was prepared by the spark plasma sintering. The effects of In content on the microstructure and properties of Cu alloys were investigated using advanced characterization. The results show that the concentration of In element linearly distributes in Cu alloy after annealing treatment at 450 °C. Most In elements exist in the Cu matrix as the solid solution atoms. Some In elements are precipitated at the grain boundaries as Cu9In4 particles when the In content is higher. The hardness of the alloy increases, while the conductivity decreases with the increase of In content, which is due to the hindrance of the movement of dislocations and electrons by solid solution atoms, grain boundaries, and Cu9In4 particles. The investigation of high throughput samples can provide data support for high strength and high conductivity Cu alloys. |
| first_indexed | 2024-03-07T23:23:30Z |
| format | Article |
| id | doaj.art-1bd88a4cf5884d0e948cf08b8dfd57e0 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-07T23:23:30Z |
| publishDate | 2023-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-1bd88a4cf5884d0e948cf08b8dfd57e02024-02-21T05:26:03ZengElsevierJournal of Materials Research and Technology2238-78542023-11-012723362345High-throughput study of the effect of indium on the microstructure and properties of copper alloyJiaoyan Dai0Chengpeng Liu1Shuaiqi Fan2Xiang-Xi Ye3School of Materials and Chemical Engineering, Ningbo University of Technology, Ningbo 315211, ChinaShanghai Institute of Applied Physics, Chinese Academy of Sciences, 2019 Jialuo Road, Shanghai 201800, China; Corresponding author.Hua Hong Semiconductor Co., Ltd. Wuxi, 214000, ChinaShanghai Institute of Applied Physics, Chinese Academy of Sciences, 2019 Jialuo Road, Shanghai 201800, China; Corresponding author.In this work, the high throughput sample of Cu-xIn (x = 0–5 wt.%) alloy was prepared by the spark plasma sintering. The effects of In content on the microstructure and properties of Cu alloys were investigated using advanced characterization. The results show that the concentration of In element linearly distributes in Cu alloy after annealing treatment at 450 °C. Most In elements exist in the Cu matrix as the solid solution atoms. Some In elements are precipitated at the grain boundaries as Cu9In4 particles when the In content is higher. The hardness of the alloy increases, while the conductivity decreases with the increase of In content, which is due to the hindrance of the movement of dislocations and electrons by solid solution atoms, grain boundaries, and Cu9In4 particles. The investigation of high throughput samples can provide data support for high strength and high conductivity Cu alloys.http://www.sciencedirect.com/science/article/pii/S2238785423025152Cu-xIn alloyHigh throughput methodSynchrotron radiation X-ray diffractionMicrostructure and performance |
| spellingShingle | Jiaoyan Dai Chengpeng Liu Shuaiqi Fan Xiang-Xi Ye High-throughput study of the effect of indium on the microstructure and properties of copper alloy Journal of Materials Research and Technology Cu-xIn alloy High throughput method Synchrotron radiation X-ray diffraction Microstructure and performance |
| title | High-throughput study of the effect of indium on the microstructure and properties of copper alloy |
| title_full | High-throughput study of the effect of indium on the microstructure and properties of copper alloy |
| title_fullStr | High-throughput study of the effect of indium on the microstructure and properties of copper alloy |
| title_full_unstemmed | High-throughput study of the effect of indium on the microstructure and properties of copper alloy |
| title_short | High-throughput study of the effect of indium on the microstructure and properties of copper alloy |
| title_sort | high throughput study of the effect of indium on the microstructure and properties of copper alloy |
| topic | Cu-xIn alloy High throughput method Synchrotron radiation X-ray diffraction Microstructure and performance |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423025152 |
| work_keys_str_mv | AT jiaoyandai highthroughputstudyoftheeffectofindiumonthemicrostructureandpropertiesofcopperalloy AT chengpengliu highthroughputstudyoftheeffectofindiumonthemicrostructureandpropertiesofcopperalloy AT shuaiqifan highthroughputstudyoftheeffectofindiumonthemicrostructureandpropertiesofcopperalloy AT xiangxiye highthroughputstudyoftheeffectofindiumonthemicrostructureandpropertiesofcopperalloy |