A New Type of Si-Based MOSFET for Radiation Reinforcement

This paper thoroughly analyses the role of drift in the sensitive region in the single-event effect (SEE), with the aim of enhancing the single-particle radiation resistance of N-type metal-oxide semiconductor field-effect transistors (MOSFETs). It proposes a design for a Si-based device structure t...

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Main Authors: Weifeng Liu, Zhirou Zhou, Dong Zhang, Jianjun Song
Format: Article
Language:English
Published: MDPI AG 2024-01-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/15/2/229
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author Weifeng Liu
Zhirou Zhou
Dong Zhang
Jianjun Song
author_facet Weifeng Liu
Zhirou Zhou
Dong Zhang
Jianjun Song
author_sort Weifeng Liu
collection DOAJ
description This paper thoroughly analyses the role of drift in the sensitive region in the single-event effect (SEE), with the aim of enhancing the single-particle radiation resistance of N-type metal-oxide semiconductor field-effect transistors (MOSFETs). It proposes a design for a Si-based device structure that extends the lightly doped source–drain region of the N-channel metal-oxide semiconductor (NMOS), thereby moderating the electric field of the sensitive region. This design leads to a 15.69% decrease in the charge collected at the leaky end of the device under the standard irradiation conditions. On this basis, a device structure is further proposed to form a composite metal-oxide semiconductor (MOS) by connecting a pn junction at the lightly doped source–drain end. By adding two charge paths, the leakage collection charge is further reduced by 13.85% under standard irradiation conditions. Moreover, the deterioration of the drive current in the purely growing lightly doped source–drain region can be further improved. Simulations of single-event effects under different irradiation conditions show that the device has good resistance to single-event irradiation, and the composite MOS structure smoothly converges to a 14.65% reduction in drain collection charge between 0.2 pC/<inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mi mathvariant="sans-serif">μ</mi></semantics></math></inline-formula>m and 1 pC/<inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mi mathvariant="sans-serif">μ</mi></semantics></math></inline-formula>m Linear Energy Transfer (LET) values. The incidence position at the source-to-channel interface collects the highest charge reduction rate of 28.23%. The collecting charge reduction rate is maximum, at 17.12%, when the incidence is at a 45-degree angle towards the source.
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spelling doaj.art-1c2209b3fa6d4004b1c71dbd5cf118e62024-02-23T15:27:41ZengMDPI AGMicromachines2072-666X2024-01-0115222910.3390/mi15020229A New Type of Si-Based MOSFET for Radiation ReinforcementWeifeng Liu0Zhirou Zhou1Dong Zhang2Jianjun Song3State Key Discipline Laboratory of Wide Band-Gap Semiconductor Devices and Integrated Technology, School of Microelectronics, Xidian University, Xi’an 710071, ChinaState Key Discipline Laboratory of Wide Band-Gap Semiconductor Devices and Integrated Technology, School of Microelectronics, Xidian University, Xi’an 710071, ChinaState Key Discipline Laboratory of Wide Band-Gap Semiconductor Devices and Integrated Technology, School of Microelectronics, Xidian University, Xi’an 710071, ChinaState Key Discipline Laboratory of Wide Band-Gap Semiconductor Devices and Integrated Technology, School of Microelectronics, Xidian University, Xi’an 710071, ChinaThis paper thoroughly analyses the role of drift in the sensitive region in the single-event effect (SEE), with the aim of enhancing the single-particle radiation resistance of N-type metal-oxide semiconductor field-effect transistors (MOSFETs). It proposes a design for a Si-based device structure that extends the lightly doped source–drain region of the N-channel metal-oxide semiconductor (NMOS), thereby moderating the electric field of the sensitive region. This design leads to a 15.69% decrease in the charge collected at the leaky end of the device under the standard irradiation conditions. On this basis, a device structure is further proposed to form a composite metal-oxide semiconductor (MOS) by connecting a pn junction at the lightly doped source–drain end. By adding two charge paths, the leakage collection charge is further reduced by 13.85% under standard irradiation conditions. Moreover, the deterioration of the drive current in the purely growing lightly doped source–drain region can be further improved. Simulations of single-event effects under different irradiation conditions show that the device has good resistance to single-event irradiation, and the composite MOS structure smoothly converges to a 14.65% reduction in drain collection charge between 0.2 pC/<inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mi mathvariant="sans-serif">μ</mi></semantics></math></inline-formula>m and 1 pC/<inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mi mathvariant="sans-serif">μ</mi></semantics></math></inline-formula>m Linear Energy Transfer (LET) values. The incidence position at the source-to-channel interface collects the highest charge reduction rate of 28.23%. The collecting charge reduction rate is maximum, at 17.12%, when the incidence is at a 45-degree angle towards the source.https://www.mdpi.com/2072-666X/15/2/229single-event effectradiation-hardenedheavy ionMOS devices
spellingShingle Weifeng Liu
Zhirou Zhou
Dong Zhang
Jianjun Song
A New Type of Si-Based MOSFET for Radiation Reinforcement
Micromachines
single-event effect
radiation-hardened
heavy ion
MOS devices
title A New Type of Si-Based MOSFET for Radiation Reinforcement
title_full A New Type of Si-Based MOSFET for Radiation Reinforcement
title_fullStr A New Type of Si-Based MOSFET for Radiation Reinforcement
title_full_unstemmed A New Type of Si-Based MOSFET for Radiation Reinforcement
title_short A New Type of Si-Based MOSFET for Radiation Reinforcement
title_sort new type of si based mosfet for radiation reinforcement
topic single-event effect
radiation-hardened
heavy ion
MOS devices
url https://www.mdpi.com/2072-666X/15/2/229
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