Additive manufacturing of aluminum nitride ceramics with high thermal conductivity via digital light processing
Aluminum nitride (AlN) powder systems for additive manufacturing (AM) via digital light processing (DLP) were successfully developed, shaped by a DLP-based manufacturing technique, and sintered at 1700 °C. Properties of the AM parts were compared to reference samples consolidated via cold-isostatic...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2022-03-01
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| Series: | Open Ceramics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666539521001619 |
| _version_ | 1818050812384903168 |
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| author | Johannes Rauchenecker Julia Rabitsch Martin Schwentenwein Thomas Konegger |
| author_facet | Johannes Rauchenecker Julia Rabitsch Martin Schwentenwein Thomas Konegger |
| author_sort | Johannes Rauchenecker |
| collection | DOAJ |
| description | Aluminum nitride (AlN) powder systems for additive manufacturing (AM) via digital light processing (DLP) were successfully developed, shaped by a DLP-based manufacturing technique, and sintered at 1700 °C. Properties of the AM parts were compared to reference samples consolidated via cold-isostatic pressing. AlN powders from two different manufacturers were used in the powder mixtures, underlining the flexibility of the process. Thorough process control was crucial for obtaining materials with a high degree of densification, exhibiting microstructural, thermal, and mechanical properties comparable to conventionally processed reference materials. Thermal conductivity of AM samples exceeded 160 W m−1 K−1, while flexural strength of AM samples varied between 320 and 498 MPa, depending on the orientation of specimens with respect to the building direction. The feasibility of this approach to generate complex-shaped parts was successfully shown by fabrication of crack-free demonstrator parts, highlighting prospective novel use cases in advanced heat management applications. |
| first_indexed | 2024-12-10T10:59:25Z |
| format | Article |
| id | doaj.art-1cce03ca8f0d4b67b06717bd199c4a0b |
| institution | Directory Open Access Journal |
| issn | 2666-5395 |
| language | English |
| last_indexed | 2024-12-10T10:59:25Z |
| publishDate | 2022-03-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Open Ceramics |
| spelling | doaj.art-1cce03ca8f0d4b67b06717bd199c4a0b2022-12-22T01:51:44ZengElsevierOpen Ceramics2666-53952022-03-019100215Additive manufacturing of aluminum nitride ceramics with high thermal conductivity via digital light processingJohannes Rauchenecker0Julia Rabitsch1Martin Schwentenwein2Thomas Konegger3TU Wien, Institute of Chemical Technologies and Analytics, Getreidemarkt 9/164-CT, 1060, Vienna, AustriaLithoz GmbH, Mollardgasse 85A/2/64-69, 1060, Vienna, AustriaLithoz GmbH, Mollardgasse 85A/2/64-69, 1060, Vienna, AustriaTU Wien, Institute of Chemical Technologies and Analytics, Getreidemarkt 9/164-CT, 1060, Vienna, Austria; Corresponding author.Aluminum nitride (AlN) powder systems for additive manufacturing (AM) via digital light processing (DLP) were successfully developed, shaped by a DLP-based manufacturing technique, and sintered at 1700 °C. Properties of the AM parts were compared to reference samples consolidated via cold-isostatic pressing. AlN powders from two different manufacturers were used in the powder mixtures, underlining the flexibility of the process. Thorough process control was crucial for obtaining materials with a high degree of densification, exhibiting microstructural, thermal, and mechanical properties comparable to conventionally processed reference materials. Thermal conductivity of AM samples exceeded 160 W m−1 K−1, while flexural strength of AM samples varied between 320 and 498 MPa, depending on the orientation of specimens with respect to the building direction. The feasibility of this approach to generate complex-shaped parts was successfully shown by fabrication of crack-free demonstrator parts, highlighting prospective novel use cases in advanced heat management applications.http://www.sciencedirect.com/science/article/pii/S2666539521001619Aluminum nitrideAdditive manufacturingThermal conductivity |
| spellingShingle | Johannes Rauchenecker Julia Rabitsch Martin Schwentenwein Thomas Konegger Additive manufacturing of aluminum nitride ceramics with high thermal conductivity via digital light processing Open Ceramics Aluminum nitride Additive manufacturing Thermal conductivity |
| title | Additive manufacturing of aluminum nitride ceramics with high thermal conductivity via digital light processing |
| title_full | Additive manufacturing of aluminum nitride ceramics with high thermal conductivity via digital light processing |
| title_fullStr | Additive manufacturing of aluminum nitride ceramics with high thermal conductivity via digital light processing |
| title_full_unstemmed | Additive manufacturing of aluminum nitride ceramics with high thermal conductivity via digital light processing |
| title_short | Additive manufacturing of aluminum nitride ceramics with high thermal conductivity via digital light processing |
| title_sort | additive manufacturing of aluminum nitride ceramics with high thermal conductivity via digital light processing |
| topic | Aluminum nitride Additive manufacturing Thermal conductivity |
| url | http://www.sciencedirect.com/science/article/pii/S2666539521001619 |
| work_keys_str_mv | AT johannesrauchenecker additivemanufacturingofaluminumnitrideceramicswithhighthermalconductivityviadigitallightprocessing AT juliarabitsch additivemanufacturingofaluminumnitrideceramicswithhighthermalconductivityviadigitallightprocessing AT martinschwentenwein additivemanufacturingofaluminumnitrideceramicswithhighthermalconductivityviadigitallightprocessing AT thomaskonegger additivemanufacturingofaluminumnitrideceramicswithhighthermalconductivityviadigitallightprocessing |