Grain-Scale Anisotropic Analysis of Steady-State Creep in Oligocrystalline SAC Solder Joints
Heterogeneous integration is leading to unprecedented miniaturization of solder joints, often with thousands of joints within a single package. The thermomechanical behavior of such SAC solder joints is critically important to assembly performance and reliability, but can be difficult to predict due...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-10-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/14/20/5973 |