Study on Cu6Sn5 morphology and grain orientation transition at the interface of (111) nt-Cu and liquid Sn

Study on Cu6Sn5 morphology and grain orientation transition at the interface of (111) nt-Cu and liquid Sn

Nanotwinned copper (nt-Cu) is considered to be very desirable choice for a pad material in system-in-package (SiP) devices due to its excellent anti-electromigration and anti-element migration properties. However, complex diffusion reactions exist between nt-Cu and Sn-based solder. Especially, morph...

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Bibliographic Details
Main Authors: Zicheng Sa, Shang Wang, Jiayun Feng, Jiayue Wen, Xudong Liu, Yanhong Tian
Format: Article
Language:English
Published: Elsevier 2023-09-01
Series:Journal of Materials Research and Technology
Subjects:
Nanotwinned copper
IMCs morphology
Grain orientation
Surface energy
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423023153

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