Failure mechanisms in flexible electronics
ABSTRACTThe rapid evolution of flexible electronic devices promises to revolutionize numerous fields by expanding the applications of smart devices. Nevertheless, despite this vast potential, the reliability of these innovative devices currently falls short, especially in light of demanding operatio...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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Taylor & Francis Group
2023-10-01
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| Series: | International Journal of Smart and Nano Materials |
| Subjects: | |
| Online Access: | https://www.tandfonline.com/doi/10.1080/19475411.2023.2261775 |
| _version_ | 1797449261118390272 |
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| author | Zhehui Zhao Haoran Fu Ruitao Tang Bocheng Zhang Yunmin Chen Jianqun Jiang |
| author_facet | Zhehui Zhao Haoran Fu Ruitao Tang Bocheng Zhang Yunmin Chen Jianqun Jiang |
| author_sort | Zhehui Zhao |
| collection | DOAJ |
| description | ABSTRACTThe rapid evolution of flexible electronic devices promises to revolutionize numerous fields by expanding the applications of smart devices. Nevertheless, despite this vast potential, the reliability of these innovative devices currently falls short, especially in light of demanding operation environment and the intrinsic challenges associated with their fabrication techniques. The heterogeneity in these processes and environments gives rise to unique failure modes throughout the devices’ lifespan. To significantly enhance the reliability of these devices and assure long-term performance, it is paramount to comprehend the underpinning failure mechanisms thoroughly, thereby enabling optimal design solutions. A myriad of investigative efforts have been dedicated to unravel these failure mechanisms, utilizing a spectrum of tools from analytical models, numerical methods, to advanced characterization methods. This review delves into the root causes of device failure, scrutinizing both the fabrication process and the operation environment. Next, We subsequently address the failure mechanisms across four commonly observed modes: strength failure, fatigue failure, interfacial failure, and electrical failure, followed by an overview of targeted characterization methods associated with each mechanism. Concluding with an outlook, we spotlight ongoing challenges and promising directions for future research in our pursuit of highly resilient flexible electronic devices. |
| first_indexed | 2024-03-09T14:22:18Z |
| format | Article |
| id | doaj.art-1e00496736ab4000ace524daa7a27d9b |
| institution | Directory Open Access Journal |
| issn | 1947-5411 1947-542X |
| language | English |
| last_indexed | 2024-03-09T14:22:18Z |
| publishDate | 2023-10-01 |
| publisher | Taylor & Francis Group |
| record_format | Article |
| series | International Journal of Smart and Nano Materials |
| spelling | doaj.art-1e00496736ab4000ace524daa7a27d9b2023-11-28T09:06:40ZengTaylor & Francis GroupInternational Journal of Smart and Nano Materials1947-54111947-542X2023-10-0114451056510.1080/19475411.2023.2261775Failure mechanisms in flexible electronicsZhehui Zhao0Haoran Fu1Ruitao Tang2Bocheng Zhang3Yunmin Chen4Jianqun Jiang5MOE Key Laboratory of Soft Soils and Geoenvironmental Engineering, Zhejiang University, Hangzhou, ChinaMOE Key Laboratory of Soft Soils and Geoenvironmental Engineering, Zhejiang University, Hangzhou, ChinaR&D department, Wuxi Innosonics Medical Technology Co, Ltd, Wuxi, ChinaR & D Department of devices and processes, Jiashan Fudan Institute, Jiaxing, ChinaMOE Key Laboratory of Soft Soils and Geoenvironmental Engineering, Zhejiang University, Hangzhou, ChinaMOE Key Laboratory of Soft Soils and Geoenvironmental Engineering, Zhejiang University, Hangzhou, ChinaABSTRACTThe rapid evolution of flexible electronic devices promises to revolutionize numerous fields by expanding the applications of smart devices. Nevertheless, despite this vast potential, the reliability of these innovative devices currently falls short, especially in light of demanding operation environment and the intrinsic challenges associated with their fabrication techniques. The heterogeneity in these processes and environments gives rise to unique failure modes throughout the devices’ lifespan. To significantly enhance the reliability of these devices and assure long-term performance, it is paramount to comprehend the underpinning failure mechanisms thoroughly, thereby enabling optimal design solutions. A myriad of investigative efforts have been dedicated to unravel these failure mechanisms, utilizing a spectrum of tools from analytical models, numerical methods, to advanced characterization methods. This review delves into the root causes of device failure, scrutinizing both the fabrication process and the operation environment. Next, We subsequently address the failure mechanisms across four commonly observed modes: strength failure, fatigue failure, interfacial failure, and electrical failure, followed by an overview of targeted characterization methods associated with each mechanism. Concluding with an outlook, we spotlight ongoing challenges and promising directions for future research in our pursuit of highly resilient flexible electronic devices.https://www.tandfonline.com/doi/10.1080/19475411.2023.2261775Flexible electronic devicesfailure mechanismscharacterization methods |
| spellingShingle | Zhehui Zhao Haoran Fu Ruitao Tang Bocheng Zhang Yunmin Chen Jianqun Jiang Failure mechanisms in flexible electronics International Journal of Smart and Nano Materials Flexible electronic devices failure mechanisms characterization methods |
| title | Failure mechanisms in flexible electronics |
| title_full | Failure mechanisms in flexible electronics |
| title_fullStr | Failure mechanisms in flexible electronics |
| title_full_unstemmed | Failure mechanisms in flexible electronics |
| title_short | Failure mechanisms in flexible electronics |
| title_sort | failure mechanisms in flexible electronics |
| topic | Flexible electronic devices failure mechanisms characterization methods |
| url | https://www.tandfonline.com/doi/10.1080/19475411.2023.2261775 |
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