Wetting of aluminum and copper substrates by lead – nickel melt
In this paper, the task of obtaining new solders for brazing nickel and its alloys. Polyterms of wetting angle for Pb − Ni melts in the range from the melting point to 940 K on copper substrates and up to 900 K on aluminum were studied and wetting thresholds were detected: wetting of copper substrat...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | Russian |
| Published: |
Tver State University
2018-12-01
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| Series: | Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов |
| Subjects: | |
| Online Access: | https://physchemaspects.ru/archives/2018/fh2018-doi-10-26456-pcascnn-2018-10-671.pdf |
| Summary: | In this paper, the task of obtaining new solders for brazing nickel and its alloys. Polyterms of wetting angle for Pb − Ni melts in the range from the melting point to 940 K on copper substrates and up to 900 K on aluminum were studied and wetting thresholds were detected: wetting of copper substrates starts at 640 K, and aluminum substrates are not wetted by the abovemelts. |
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| ISSN: | 2226-4442 2658-4360 |