Effect of abrasive vibration on microstructure evolution and material removal of SiC CMP

Effect of abrasive vibration on microstructure evolution and material removal of SiC CMP

To address issues related to abrasion, agglomeration, and the challenges of mechanical and chemical release during chemical mechanical polishing (CMP), a vibration-assisted CMP method is employed. Molecular dynamics simulation analyze the dynamic evolution of frequency, amplitude, and indentation de...

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Bibliographic Details
Main Authors: Ailing TANG, Zewei YUAN, Meiling TANG, Ying WANG
Format: Article
Language:zho
Published: Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd. 2024-02-01
Series:Jin'gangshi yu moliao moju gongcheng
Subjects:
silicon carbide
vibration
chemical mechanical polishing (cmp)
molecular dynamics
Online Access:http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2023.0053

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