Next generation non-vacuum, maskless, low temperature nanoparticle ink laser digital direct metal patterning for a large area flexible electronics.
Flexible electronics opened a new class of future electronics. The foldable, light and durable nature of flexible electronics allows vast flexibility in applications such as display, energy devices and mobile electronics. Even though conventional electronics fabrication methods are well developed fo...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Public Library of Science (PLoS)
2012-01-01
|
| Series: | PLoS ONE |
| Online Access: | http://europepmc.org/articles/PMC3416833?pdf=render |
| _version_ | 1818310467500638208 |
|---|---|
| author | Junyeob Yeo Sukjoon Hong Daehoo Lee Nico Hotz Ming-Tsang Lee Costas P Grigoropoulos Seung Hwan Ko Seung Hwan Ko |
| author_facet | Junyeob Yeo Sukjoon Hong Daehoo Lee Nico Hotz Ming-Tsang Lee Costas P Grigoropoulos Seung Hwan Ko Seung Hwan Ko |
| author_sort | Junyeob Yeo |
| collection | DOAJ |
| description | Flexible electronics opened a new class of future electronics. The foldable, light and durable nature of flexible electronics allows vast flexibility in applications such as display, energy devices and mobile electronics. Even though conventional electronics fabrication methods are well developed for rigid substrates, direct application or slight modification of conventional processes for flexible electronics fabrication cannot work. The future flexible electronics fabrication requires totally new low-temperature process development optimized for flexible substrate and it should be based on new material too. Here we present a simple approach to developing a flexible electronics fabrication without using conventional vacuum deposition and photolithography. We found that direct metal patterning based on laser-induced local melting of metal nanoparticle ink is a promising low-temperature alternative to vacuum deposition- and photolithography-based conventional metal patterning processes. The "digital" nature of the proposed direct metal patterning process removes the need for expensive photomask and allows easy design modification and short turnaround time. This new process can be extremely useful for current small-volume, large-variety manufacturing paradigms. Besides, simple, scalable, fast and low-temperature processes can lead to cost-effective fabrication methods on a large-area polymer substrate. The developed process was successfully applied to demonstrate high-quality Ag patterning (2.1 µΩ·cm) and high-performance flexible organic field effect transistor arrays. |
| first_indexed | 2024-12-13T07:46:32Z |
| format | Article |
| id | doaj.art-1f14e11830d74748bfcd4938f14ef914 |
| institution | Directory Open Access Journal |
| issn | 1932-6203 |
| language | English |
| last_indexed | 2024-12-13T07:46:32Z |
| publishDate | 2012-01-01 |
| publisher | Public Library of Science (PLoS) |
| record_format | Article |
| series | PLoS ONE |
| spelling | doaj.art-1f14e11830d74748bfcd4938f14ef9142022-12-21T23:54:48ZengPublic Library of Science (PLoS)PLoS ONE1932-62032012-01-0178e4231510.1371/journal.pone.0042315Next generation non-vacuum, maskless, low temperature nanoparticle ink laser digital direct metal patterning for a large area flexible electronics.Junyeob YeoSukjoon HongDaehoo LeeNico HotzMing-Tsang LeeCostas P GrigoropoulosSeung Hwan KoSeung Hwan KoFlexible electronics opened a new class of future electronics. The foldable, light and durable nature of flexible electronics allows vast flexibility in applications such as display, energy devices and mobile electronics. Even though conventional electronics fabrication methods are well developed for rigid substrates, direct application or slight modification of conventional processes for flexible electronics fabrication cannot work. The future flexible electronics fabrication requires totally new low-temperature process development optimized for flexible substrate and it should be based on new material too. Here we present a simple approach to developing a flexible electronics fabrication without using conventional vacuum deposition and photolithography. We found that direct metal patterning based on laser-induced local melting of metal nanoparticle ink is a promising low-temperature alternative to vacuum deposition- and photolithography-based conventional metal patterning processes. The "digital" nature of the proposed direct metal patterning process removes the need for expensive photomask and allows easy design modification and short turnaround time. This new process can be extremely useful for current small-volume, large-variety manufacturing paradigms. Besides, simple, scalable, fast and low-temperature processes can lead to cost-effective fabrication methods on a large-area polymer substrate. The developed process was successfully applied to demonstrate high-quality Ag patterning (2.1 µΩ·cm) and high-performance flexible organic field effect transistor arrays.http://europepmc.org/articles/PMC3416833?pdf=render |
| spellingShingle | Junyeob Yeo Sukjoon Hong Daehoo Lee Nico Hotz Ming-Tsang Lee Costas P Grigoropoulos Seung Hwan Ko Seung Hwan Ko Next generation non-vacuum, maskless, low temperature nanoparticle ink laser digital direct metal patterning for a large area flexible electronics. PLoS ONE |
| title | Next generation non-vacuum, maskless, low temperature nanoparticle ink laser digital direct metal patterning for a large area flexible electronics. |
| title_full | Next generation non-vacuum, maskless, low temperature nanoparticle ink laser digital direct metal patterning for a large area flexible electronics. |
| title_fullStr | Next generation non-vacuum, maskless, low temperature nanoparticle ink laser digital direct metal patterning for a large area flexible electronics. |
| title_full_unstemmed | Next generation non-vacuum, maskless, low temperature nanoparticle ink laser digital direct metal patterning for a large area flexible electronics. |
| title_short | Next generation non-vacuum, maskless, low temperature nanoparticle ink laser digital direct metal patterning for a large area flexible electronics. |
| title_sort | next generation non vacuum maskless low temperature nanoparticle ink laser digital direct metal patterning for a large area flexible electronics |
| url | http://europepmc.org/articles/PMC3416833?pdf=render |
| work_keys_str_mv | AT junyeobyeo nextgenerationnonvacuummasklesslowtemperaturenanoparticleinklaserdigitaldirectmetalpatterningforalargeareaflexibleelectronics AT sukjoonhong nextgenerationnonvacuummasklesslowtemperaturenanoparticleinklaserdigitaldirectmetalpatterningforalargeareaflexibleelectronics AT daehoolee nextgenerationnonvacuummasklesslowtemperaturenanoparticleinklaserdigitaldirectmetalpatterningforalargeareaflexibleelectronics AT nicohotz nextgenerationnonvacuummasklesslowtemperaturenanoparticleinklaserdigitaldirectmetalpatterningforalargeareaflexibleelectronics AT mingtsanglee nextgenerationnonvacuummasklesslowtemperaturenanoparticleinklaserdigitaldirectmetalpatterningforalargeareaflexibleelectronics AT costaspgrigoropoulos nextgenerationnonvacuummasklesslowtemperaturenanoparticleinklaserdigitaldirectmetalpatterningforalargeareaflexibleelectronics AT seunghwanko nextgenerationnonvacuummasklesslowtemperaturenanoparticleinklaserdigitaldirectmetalpatterningforalargeareaflexibleelectronics AT seunghwanko nextgenerationnonvacuummasklesslowtemperaturenanoparticleinklaserdigitaldirectmetalpatterningforalargeareaflexibleelectronics |