Effect of the Graphene Quantum Dot Content on the Thermal, Dynamic-Mechanical, and Morphological Properties of Epoxy Resin
Different amounts of graphene quantum dots (CQDs) (0, 1, 2.5, and 5 wt%) were incorporated into an epoxy matrix. The thermal conductivity, density, morphology, and dynamic mechanical thermal (DMTA) properties were reused from the study of Seibert et al.. The Pearson plot showed a high correlation be...
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MDPI AG
2023-11-01
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author | Bárbara Schneider Heitor Luiz Ornaghi Jr. Francisco Maciel Monticeli Daiane Romanzini |
author_facet | Bárbara Schneider Heitor Luiz Ornaghi Jr. Francisco Maciel Monticeli Daiane Romanzini |
author_sort | Bárbara Schneider |
collection | DOAJ |
description | Different amounts of graphene quantum dots (CQDs) (0, 1, 2.5, and 5 wt%) were incorporated into an epoxy matrix. The thermal conductivity, density, morphology, and dynamic mechanical thermal (DMTA) properties were reused from the study of Seibert et al.. The Pearson plot showed a high correlation between mass loading, thermal conductivity, and thermal diffusivity. A poorer correlation with density and heat capacity was observed. At lower CQD concentrations (0.1 wt%), the fracture surface showed to be more heterogeneous, while at higher amounts (2.5 and 5 wt%), a more homogeneous surface was observed. The storage modulus values did not change with the CQD amount. But the extension of the glassy plateau increased with higher CQD contents, with an increase of ~40 °C for the 5 wt% compared to the 2.5 wt% and almost twice compared to the neat epoxy. This result is attributed to the intrinsic characteristics of the filler. Additionally, lower energy dissipation and a higher glass transition temperature were observed with the CQD amount. The novelty and importance are related to the fact that for more rigid matrices (corroborated with the literature), the mechanical properties did not change, because the polymer bridging mechanism was not present, in spite of the excellent CQD dispersion as well as the filler amount. On the other hand, thermal conductivity is directly related to particle size and dispersion. |
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spelling | doaj.art-2000aeb69c094922945a2901829aa5582023-12-08T15:24:18ZengMDPI AGPolymers2073-43602023-11-011523453110.3390/polym15234531Effect of the Graphene Quantum Dot Content on the Thermal, Dynamic-Mechanical, and Morphological Properties of Epoxy ResinBárbara Schneider0Heitor Luiz Ornaghi Jr.1Francisco Maciel Monticeli2Daiane Romanzini3Mantova Indústria de Tubos Plásticos Ltd.a., Rua Archimedes Manenti, 574, B. Centenário, Caxias do Sul 950450-175, RS, BrazilPostgraduate Program in Technology and Materials Engineering (PPGTEM), Federal Institute of Education, Science and Technology of Rio Grande do Sul (IFRS), R. Princesa Isabel, 60, Feliz 95770-000, RS, BrazilDepartment of Aerospace Structures and Materials, Delft University of Technology, Mekelweg 5, 2628 CD Delft, The NetherlandsPostgraduate Program in Technology and Materials Engineering (PPGTEM), Federal Institute of Education, Science and Technology of Rio Grande do Sul (IFRS), R. Princesa Isabel, 60, Feliz 95770-000, RS, BrazilDifferent amounts of graphene quantum dots (CQDs) (0, 1, 2.5, and 5 wt%) were incorporated into an epoxy matrix. The thermal conductivity, density, morphology, and dynamic mechanical thermal (DMTA) properties were reused from the study of Seibert et al.. The Pearson plot showed a high correlation between mass loading, thermal conductivity, and thermal diffusivity. A poorer correlation with density and heat capacity was observed. At lower CQD concentrations (0.1 wt%), the fracture surface showed to be more heterogeneous, while at higher amounts (2.5 and 5 wt%), a more homogeneous surface was observed. The storage modulus values did not change with the CQD amount. But the extension of the glassy plateau increased with higher CQD contents, with an increase of ~40 °C for the 5 wt% compared to the 2.5 wt% and almost twice compared to the neat epoxy. This result is attributed to the intrinsic characteristics of the filler. Additionally, lower energy dissipation and a higher glass transition temperature were observed with the CQD amount. The novelty and importance are related to the fact that for more rigid matrices (corroborated with the literature), the mechanical properties did not change, because the polymer bridging mechanism was not present, in spite of the excellent CQD dispersion as well as the filler amount. On the other hand, thermal conductivity is directly related to particle size and dispersion.https://www.mdpi.com/2073-4360/15/23/4531carbon quantum dotsepoxy nanocompositethermal conductivitystructure and property relationship |
spellingShingle | Bárbara Schneider Heitor Luiz Ornaghi Jr. Francisco Maciel Monticeli Daiane Romanzini Effect of the Graphene Quantum Dot Content on the Thermal, Dynamic-Mechanical, and Morphological Properties of Epoxy Resin Polymers carbon quantum dots epoxy nanocomposite thermal conductivity structure and property relationship |
title | Effect of the Graphene Quantum Dot Content on the Thermal, Dynamic-Mechanical, and Morphological Properties of Epoxy Resin |
title_full | Effect of the Graphene Quantum Dot Content on the Thermal, Dynamic-Mechanical, and Morphological Properties of Epoxy Resin |
title_fullStr | Effect of the Graphene Quantum Dot Content on the Thermal, Dynamic-Mechanical, and Morphological Properties of Epoxy Resin |
title_full_unstemmed | Effect of the Graphene Quantum Dot Content on the Thermal, Dynamic-Mechanical, and Morphological Properties of Epoxy Resin |
title_short | Effect of the Graphene Quantum Dot Content on the Thermal, Dynamic-Mechanical, and Morphological Properties of Epoxy Resin |
title_sort | effect of the graphene quantum dot content on the thermal dynamic mechanical and morphological properties of epoxy resin |
topic | carbon quantum dots epoxy nanocomposite thermal conductivity structure and property relationship |
url | https://www.mdpi.com/2073-4360/15/23/4531 |
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