Ultrathin damage-tolerant flexible metal interconnects reinforced by in-situ graphene synthesis
Abstract Conductive patterned metal films bonded to compliant elastomeric substrates form meshes which enable flexible electronic interconnects for various applications. However, while bottom-up deposition of thin films by sputtering or growth is well-developed for rigid electronics, maintaining goo...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2024-03-01
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| Series: | npj Flexible Electronics |
| Online Access: | https://doi.org/10.1038/s41528-024-00300-8 |