Asymmetric and Flexible Ag-MXene/ANFs Composite Papers for Electromagnetic Shielding and Thermal Management

Lightweight, flexible, and electrically conductive thin films with high electromagnetic interference (EMI) shielding effectiveness and excellent thermal management capability are ideal for portable and flexible electronic devices. Herein, the asymmetric and multilayered structure Ag-MXene/ANFs compo...

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Bibliographic Details
Main Authors: Xiaoai Ye, Xu Zhang, Xinsheng Zhou, Guigen Wang
Format: Article
Language:English
Published: MDPI AG 2023-09-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/13/18/2608
Description
Summary:Lightweight, flexible, and electrically conductive thin films with high electromagnetic interference (EMI) shielding effectiveness and excellent thermal management capability are ideal for portable and flexible electronic devices. Herein, the asymmetric and multilayered structure Ag-MXene/ANFs composite papers (AMAGM) were fabricated based on Ag-MXene hybrids and aramid nanofibers (ANFs) via a self-reduction and alternating vacuum-assisted filtration process. The resultant AMAGM composite papers exhibit high electrical conductivity of 248,120 S m<sup>−1</sup>, excellent mechanical properties with tensile strength of 124.21 MPa and fracture strain of 4.98%, superior EMI shielding effectiveness (62 dB), ultra-high EMI SE/t (11,923 dB cm<sup>2</sup> g<sup>−1</sup>) and outstanding EMI SE reliability as high as 96.1% even after 5000 cycles of bending deformation benefiting from the unique structure and the 3D network at a thickness of 34 μm. Asymmetric structures play an important role in regulating reflection and absorption of electromagnetic waves. In addition, the multifunctional nanocomposite papers reveal outstanding thermal management performances such as ultrafast thermal response, high heating temperatures at low operation voltage, and high heating stability. The results indicate that the AMAGM composite papers have excellent potential for high-integration electromagnetic shielding, wearable electronics, artificial intelligence, and high-performance heating devices.
ISSN:2079-4991