Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints
The effect of SiC nano-phases (nano-particles and nano-fibers) addition into SAC0307 solder paste was investigated on the thermal and microstructural properties of the composite solder joints. The nano-phases were used between 0.125 and 1 wt%, and they were mixed into the solder paste by ball millin...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2023-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422018312 |
| _version_ | 1797942998946807808 |
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| author | Agata Skwarek Balázs Illés Paweł Górecki Adrian Pietruszka Jacek Tarasiuk Tamás Hurtony |
| author_facet | Agata Skwarek Balázs Illés Paweł Górecki Adrian Pietruszka Jacek Tarasiuk Tamás Hurtony |
| author_sort | Agata Skwarek |
| collection | DOAJ |
| description | The effect of SiC nano-phases (nano-particles and nano-fibers) addition into SAC0307 solder paste was investigated on the thermal and microstructural properties of the composite solder joints. The nano-phases were used between 0.125 and 1 wt%, and they were mixed into the solder paste by ball milling process. For the study power MOSFET (metal oxide semiconductor field effect transistor) components were soldered onto metal core printed circuit boards (MCPCBs). The thermal impedance Zth(t) and thermal resistance Rth of MOSFETs were measured by an indirect electrical method. Furthermore, the void formation and the microstructure of solder joints were also studied. The solderability and voiding properties of the composite solder alloys were acceptable. It was found that in 0.5 wt% amount, SiC nano-particles have positive effects on the thermal parameters of the solder joints, which could be explained by the IMC (intermetallic compound) layer growth suppression effect of the nano-phases. The microstructural analysis revealed that the microstructural refinement of the composite solder joints differs in the case of nano-particles and nano-fibers. |
| first_indexed | 2024-04-10T20:17:28Z |
| format | Article |
| id | doaj.art-205239e9ba634300a76013c2c8ab1d7e |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-04-10T20:17:28Z |
| publishDate | 2023-01-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-205239e9ba634300a76013c2c8ab1d7e2023-01-26T04:45:36ZengElsevierJournal of Materials Research and Technology2238-78542023-01-0122403412Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder jointsAgata Skwarek0Balázs Illés1Paweł Górecki2Adrian Pietruszka3Jacek Tarasiuk4Tamás Hurtony5Łukasiewicz Research Network-Institute of Microelectronics and Photonics, Zablocie 39, 30-701 Kraków, Poland; Gdynia Maritime University, Morska 81-87, 81-225 Gdynia, Poland; Corresponding author.Budapest University of Technology and Economics, Egry 18, Budapest, HungaryGdynia Maritime University, Morska 81-87, 81-225 Gdynia, PolandGdynia Maritime University, Morska 81-87, 81-225 Gdynia, PolandAGH-University of Science and Technology, 30-059 Kraków, PolandBudapest University of Technology and Economics, Egry 18, Budapest, HungaryThe effect of SiC nano-phases (nano-particles and nano-fibers) addition into SAC0307 solder paste was investigated on the thermal and microstructural properties of the composite solder joints. The nano-phases were used between 0.125 and 1 wt%, and they were mixed into the solder paste by ball milling process. For the study power MOSFET (metal oxide semiconductor field effect transistor) components were soldered onto metal core printed circuit boards (MCPCBs). The thermal impedance Zth(t) and thermal resistance Rth of MOSFETs were measured by an indirect electrical method. Furthermore, the void formation and the microstructure of solder joints were also studied. The solderability and voiding properties of the composite solder alloys were acceptable. It was found that in 0.5 wt% amount, SiC nano-particles have positive effects on the thermal parameters of the solder joints, which could be explained by the IMC (intermetallic compound) layer growth suppression effect of the nano-phases. The microstructural analysis revealed that the microstructural refinement of the composite solder joints differs in the case of nano-particles and nano-fibers.http://www.sciencedirect.com/science/article/pii/S2238785422018312Composite solderSiCNano-particlesNano-fiberMicrostructural refinementThermal parameters |
| spellingShingle | Agata Skwarek Balázs Illés Paweł Górecki Adrian Pietruszka Jacek Tarasiuk Tamás Hurtony Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints Journal of Materials Research and Technology Composite solder SiC Nano-particles Nano-fiber Microstructural refinement Thermal parameters |
| title | Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints |
| title_full | Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints |
| title_fullStr | Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints |
| title_full_unstemmed | Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints |
| title_short | Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints |
| title_sort | influence of sic reinforcement on microstructural and thermal properties of sac0307 solder joints |
| topic | Composite solder SiC Nano-particles Nano-fiber Microstructural refinement Thermal parameters |
| url | http://www.sciencedirect.com/science/article/pii/S2238785422018312 |
| work_keys_str_mv | AT agataskwarek influenceofsicreinforcementonmicrostructuralandthermalpropertiesofsac0307solderjoints AT balazsilles influenceofsicreinforcementonmicrostructuralandthermalpropertiesofsac0307solderjoints AT pawełgorecki influenceofsicreinforcementonmicrostructuralandthermalpropertiesofsac0307solderjoints AT adrianpietruszka influenceofsicreinforcementonmicrostructuralandthermalpropertiesofsac0307solderjoints AT jacektarasiuk influenceofsicreinforcementonmicrostructuralandthermalpropertiesofsac0307solderjoints AT tamashurtony influenceofsicreinforcementonmicrostructuralandthermalpropertiesofsac0307solderjoints |