Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer
The intermetallic compounds formed during the diffusion soldering of a Bi2Te2.55Se0.45 thermoelectric material with a Cu electrode are investigated. For this bonding process, Bi2Te2.55Se0.45 was pre-coated with a 1 μm Sn thin film on the thermoelectric element and pre-heated at 250 °C for 3 min befo...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2016-04-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2075-4701/6/4/92 |