Effect of chip temperature during bonding on particleboard properties

Effect of chip temperature during bonding on particleboard properties

In the production of particleboard, the chips emerging from the drying oven usually pass into the bonding process without sufficiently cooling down. Moreover, along with the effect of friction during the bonding process, the increased chip temperature boosts the consumption of resin/adhesive and af...

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Bibliographic Details
Main Authors: Abdullah İstek, Özgür Yiğittap, İsmail Özlüsoylu
Format: Article
Language:English
Published: Universidad del Bío-Bío 2023-02-01
Series:Maderas: Ciencia y Tecnología
Subjects:
Chip temperature
mechanical properties
particleboard
urea formaldehyde resin
wood-based panels
Online Access:https://revistas.ubiobio.cl/index.php/MCT/article/view/5814

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