Solidification microstructure characteristics of Cu–Pb alloy by ECP treatment
The effects of high-density electric current pulse (ECP) treatment on the solidification of Cu–37.4 wt% Pb monotectic alloy melt were investigated. Compared to the method of molten glass purification combined with cyclic superheating, ECP treatment created finer microstructures of Cu–Pb alloys, with...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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De Gruyter
2021-12-01
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| Series: | High Temperature Materials and Processes |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/htmp-2021-0039 |
| _version_ | 1819001803906220032 |
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| author | Ma Teng Sun Xiaosi Ning Yanan Hao Weixin |
| author_facet | Ma Teng Sun Xiaosi Ning Yanan Hao Weixin |
| author_sort | Ma Teng |
| collection | DOAJ |
| description | The effects of high-density electric current pulse (ECP) treatment on the solidification of Cu–37.4 wt% Pb monotectic alloy melt were investigated. Compared to the method of molten glass purification combined with cyclic superheating, ECP treatment created finer microstructures of Cu–Pb alloys, with more homogeneous distribution of the Pb phase in the matrix. This phenomenon can be explained by the cluster theory for liquid metals and the non-equilibrium diffusion theory. First, ECP treatment could cause the fission of larger atomic clusters to increase the undercooling that enabled a large number of smaller clusters to grow and reach the critical nucleation radius. Second, ECP treatment could reduce the diffusion energy barrier to enhance the non-equilibrium diffusion of solute atoms and suppress the segregation of Pb. |
| first_indexed | 2024-12-20T22:55:01Z |
| format | Article |
| id | doaj.art-219032a83b4446afb02f0440ac21e193 |
| institution | Directory Open Access Journal |
| issn | 2191-0324 |
| language | English |
| last_indexed | 2024-12-20T22:55:01Z |
| publishDate | 2021-12-01 |
| publisher | De Gruyter |
| record_format | Article |
| series | High Temperature Materials and Processes |
| spelling | doaj.art-219032a83b4446afb02f0440ac21e1932022-12-21T19:24:08ZengDe GruyterHigh Temperature Materials and Processes2191-03242021-12-0140138238810.1515/htmp-2021-0039Solidification microstructure characteristics of Cu–Pb alloy by ECP treatmentMa Teng0Sun Xiaosi1Ning Yanan2Hao Weixin3Department of Mathematics, Jinzhong University, Jinzhong 030619, Shanxi, ChinaDepartment of Metallurgy and Environmental Engineering, Shanxi Engineering Vocational College, Taiyuan 030002, Shanxi, ChinaSchool of Mathematical Sciences, Shanxi University, Taiyuan 030006, ChinaSchool of Materials Science and Engineering, Taiyuan University of Science and Technology, Taiyuan 030024, ChinaThe effects of high-density electric current pulse (ECP) treatment on the solidification of Cu–37.4 wt% Pb monotectic alloy melt were investigated. Compared to the method of molten glass purification combined with cyclic superheating, ECP treatment created finer microstructures of Cu–Pb alloys, with more homogeneous distribution of the Pb phase in the matrix. This phenomenon can be explained by the cluster theory for liquid metals and the non-equilibrium diffusion theory. First, ECP treatment could cause the fission of larger atomic clusters to increase the undercooling that enabled a large number of smaller clusters to grow and reach the critical nucleation radius. Second, ECP treatment could reduce the diffusion energy barrier to enhance the non-equilibrium diffusion of solute atoms and suppress the segregation of Pb.https://doi.org/10.1515/htmp-2021-0039electric current pulseundercoolinggrain refinementsolidification structurecu–37.4 wt% pb alloy |
| spellingShingle | Ma Teng Sun Xiaosi Ning Yanan Hao Weixin Solidification microstructure characteristics of Cu–Pb alloy by ECP treatment High Temperature Materials and Processes electric current pulse undercooling grain refinement solidification structure cu–37.4 wt% pb alloy |
| title | Solidification microstructure characteristics of Cu–Pb alloy by ECP treatment |
| title_full | Solidification microstructure characteristics of Cu–Pb alloy by ECP treatment |
| title_fullStr | Solidification microstructure characteristics of Cu–Pb alloy by ECP treatment |
| title_full_unstemmed | Solidification microstructure characteristics of Cu–Pb alloy by ECP treatment |
| title_short | Solidification microstructure characteristics of Cu–Pb alloy by ECP treatment |
| title_sort | solidification microstructure characteristics of cu pb alloy by ecp treatment |
| topic | electric current pulse undercooling grain refinement solidification structure cu–37.4 wt% pb alloy |
| url | https://doi.org/10.1515/htmp-2021-0039 |
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