Effect of Copper and Titanium-Exchanged Montmorillonite Nanostructures on the Packaging Performance of Chitosan/Poly-Vinyl-Alcohol-Based Active Packaging Nanocomposite Films

In this study, CuMt and TiMt montmorillonites were produced via an ion-exchange process with Cu<sup>+</sup> and Ti<sup>4+</sup> ions. These nanostructured materials were characterized with X-ray diffraction (XRD) and fourier transform infrared spectroscopy (FTIR) measurements...

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Bibliographic Details
Main Authors: Constantinos E. Salmas, Aris E. Giannakas, Maria Baikousi, Eleni Kollia, Vasiliki Tsigkou, Charalampos Proestos
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Foods
Subjects:
Online Access:https://www.mdpi.com/2304-8158/10/12/3038
Description
Summary:In this study, CuMt and TiMt montmorillonites were produced via an ion-exchange process with Cu<sup>+</sup> and Ti<sup>4+</sup> ions. These nanostructured materials were characterized with X-ray diffraction (XRD) and fourier transform infrared spectroscopy (FTIR) measurements and added as nanoreinforcements and active agents in chitosan (CS)/poly-vinyl-alcohol (PVOH)-based packaging films. The developed films were characterized by XRD and FTIR measurements. The antimicrobial, tensile, and oxygen/water-barrier measurements for the evaluation of the packaging performance were carried out to the obtained CS/PVOH/CuMt and CS/PVOH/TiMt films. The results of this study indicated that CS/PVOH/CuMt film is a stronger intercalated nanocomposite structure compared to the CS/PVOH/TiMt film. This fact reflected higher tensile strength and water/oxygen-barrier properties. The antibacterial activity of these films was tested against four food pathogenic bacteria: <i>Escherichia coli</i>, <i>Staphylococcus aureus</i>, <i>Salmonella enterica</i> and <i>Listeria monocytogenes</i>. Results showed that in most cases, the antibacterial activity was generated by the CuMt and TiMt nanostructures. Thus, both CS/PVOH/CuMt and CS/PVOH/TiMt films are nanocomposite candidates with very good perspectives for future applications on food edible active packaging.
ISSN:2304-8158