High-Level Crosstalk Model in N-Coupled Through-Silicon Vias (TSVs)
This paper proposes a regression noise model that can cover the noise effect from N-coupled TSVs based on SPICE simulation and reliability analysis flow for high-level simulation using a regression model. Regression analysis is adopted to develop a simple noise model with a single parameter and us...
| Главные авторы: | , , |
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| Формат: | Статья |
| Язык: | English |
| Опубликовано: |
Stefan cel Mare University of Suceava
2018-08-01
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| Серии: | Advances in Electrical and Computer Engineering |
| Предметы: | |
| Online-ссылка: | http://dx.doi.org/10.4316/AECE.2018.03002 |