Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications
In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ<sub>0</sub>). Double-sided redistribution layers (RDLs) were employed to build...
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| Format: | Article |
| Language: | English |
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MDPI AG
2024-02-01
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| Series: | Electronics |
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| Online Access: | https://www.mdpi.com/2079-9292/13/5/839 |
| _version_ | 1797264628143620096 |
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| author | Yuhang Yin Chenhui Xia Shuli Liu Zhimo Zhang Chen Chen Gang Wang Chenqian Wang Yafei Wu |
| author_facet | Yuhang Yin Chenhui Xia Shuli Liu Zhimo Zhang Chen Chen Gang Wang Chenqian Wang Yafei Wu |
| author_sort | Yuhang Yin |
| collection | DOAJ |
| description | In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ<sub>0</sub>). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications. |
| first_indexed | 2024-04-25T00:31:55Z |
| format | Article |
| id | doaj.art-268ac09a227e4eaf8a4a84e171db7543 |
| institution | Directory Open Access Journal |
| issn | 2079-9292 |
| language | English |
| last_indexed | 2024-04-25T00:31:55Z |
| publishDate | 2024-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Electronics |
| spelling | doaj.art-268ac09a227e4eaf8a4a84e171db75432024-03-12T16:42:20ZengMDPI AGElectronics2079-92922024-02-0113583910.3390/electronics13050839Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave ApplicationsYuhang Yin0Chenhui Xia1Shuli Liu2Zhimo Zhang3Chen Chen4Gang Wang5Chenqian Wang6Yafei Wu7The 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214035, ChinaThe 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214035, ChinaThe 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214035, ChinaThe 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214035, ChinaSchool of Electronic Science & Engineering, Southeast University, Wuxi 214111, ChinaThe 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214035, ChinaThe 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214035, ChinaSchool of Electronic Science and Engineering, University of Electronic Science and Technology of China (UESTC), Chengdu 611731, ChinaIn this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ<sub>0</sub>). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications.https://www.mdpi.com/2079-9292/13/5/839FOWLPTMV interposerAiPultrathin5G mm-wave |
| spellingShingle | Yuhang Yin Chenhui Xia Shuli Liu Zhimo Zhang Chen Chen Gang Wang Chenqian Wang Yafei Wu Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications Electronics FOWLP TMV interposer AiP ultrathin 5G mm-wave |
| title | Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications |
| title_full | Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications |
| title_fullStr | Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications |
| title_full_unstemmed | Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications |
| title_short | Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications |
| title_sort | ultrathin antenna in package based on tmv embedded fowlp for 5g mm wave applications |
| topic | FOWLP TMV interposer AiP ultrathin 5G mm-wave |
| url | https://www.mdpi.com/2079-9292/13/5/839 |
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