Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications
In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ<sub>0</sub>). Double-sided redistribution layers (RDLs) were employed to build...
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-02-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/13/5/839 |