Leakage pressures for gasketless superhydrophobic fluid interconnects for modular lab-on-a-chip systems
Abstract Chip-to-chip and world-to-chip fluidic interconnections are paramount to enable the passage of liquids between component chips and to/from microfluidic systems. Unfortunately, most interconnect designs add additional physical constraints to chips with each additional interconnect leading to...
Main Authors: | Christopher R. Brown, Xiaoxiao Zhao, Taehyun Park, Pin-Chuan Chen, Byoung Hee You, Daniel S. Park, Steven A. Soper, Alison Baird, Michael C. Murphy |
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Format: | Article |
Language: | English |
Published: |
Nature Publishing Group
2021-09-01
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Series: | Microsystems & Nanoengineering |
Online Access: | https://doi.org/10.1038/s41378-021-00287-6 |
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