Aluminum Patterned Electroplating from AlCl<sub>3</sub>–[EMIm]Cl Ionic Liquid towards Microsystems Application
Electroplating process is being used to deposit a relatively thick film of metallic materials for various microsystems applications, such as for the wafer-level bonding sealing frame and as a thermal actuator. Recently, the Al electroplating process from ionic liquid has been an attractive depositio...
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| Format: | Article |
| Language: | English |
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MDPI AG
2018-11-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/9/11/589 |
| _version_ | 1818198110517592064 |
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| author | Muhammad Salman Al Farisi Silvia Hertel Maik Wiemer Thomas Otto |
| author_facet | Muhammad Salman Al Farisi Silvia Hertel Maik Wiemer Thomas Otto |
| author_sort | Muhammad Salman Al Farisi |
| collection | DOAJ |
| description | Electroplating process is being used to deposit a relatively thick film of metallic materials for various microsystems applications, such as for the wafer-level bonding sealing frame and as a thermal actuator. Recently, the Al electroplating process from ionic liquid has been an attractive deposition method for anti-corrosion coatings. To extend the utilization of the film, in particular for microsystems application, a microstructure formation by patterned electroplating of Al from AlCl<inline-formula> <math display="inline"> <semantics> <msub> <mrow></mrow> <mn>3</mn> </msub> </semantics> </math> </inline-formula>⁻1-ethyl-3-methylimidazolium chloride ((EMIm)Cl) ionic liquid is investigated in this study. The influences of each deposition parameters to the electroplating process as well as the resulting surface morphology are evaluated. Electroplated Al deposits on both Au and Al seed layers are both studied. It is also found that a recurrent galvanic pulse plating process yields in a higher current efficiency. Finally, Al electroplating on a 2 µm-trenched 100 mm-wafer is also demonstrated. |
| first_indexed | 2024-12-12T02:00:40Z |
| format | Article |
| id | doaj.art-26a271c799274dc78b62fb1addf4ea70 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-12-12T02:00:40Z |
| publishDate | 2018-11-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-26a271c799274dc78b62fb1addf4ea702022-12-22T00:42:11ZengMDPI AGMicromachines2072-666X2018-11-0191158910.3390/mi9110589mi9110589Aluminum Patterned Electroplating from AlCl<sub>3</sub>–[EMIm]Cl Ionic Liquid towards Microsystems ApplicationMuhammad Salman Al Farisi0Silvia Hertel1Maik Wiemer2Thomas Otto3Department of Robotics, Graduate School of Engineering, Tohoku University, Sendai 980-8579, JapanFraunhofer Institute for Electronic Nano Systems (ENAS), 09126 Chemnitz, GermanyFraunhofer Institute for Electronic Nano Systems (ENAS), 09126 Chemnitz, GermanyFraunhofer Institute for Electronic Nano Systems (ENAS), 09126 Chemnitz, GermanyElectroplating process is being used to deposit a relatively thick film of metallic materials for various microsystems applications, such as for the wafer-level bonding sealing frame and as a thermal actuator. Recently, the Al electroplating process from ionic liquid has been an attractive deposition method for anti-corrosion coatings. To extend the utilization of the film, in particular for microsystems application, a microstructure formation by patterned electroplating of Al from AlCl<inline-formula> <math display="inline"> <semantics> <msub> <mrow></mrow> <mn>3</mn> </msub> </semantics> </math> </inline-formula>⁻1-ethyl-3-methylimidazolium chloride ((EMIm)Cl) ionic liquid is investigated in this study. The influences of each deposition parameters to the electroplating process as well as the resulting surface morphology are evaluated. Electroplated Al deposits on both Au and Al seed layers are both studied. It is also found that a recurrent galvanic pulse plating process yields in a higher current efficiency. Finally, Al electroplating on a 2 µm-trenched 100 mm-wafer is also demonstrated.https://www.mdpi.com/2072-666X/9/11/589aluminumelectro-chemical depositionionic liquidrecurrent galvanic pulsepatterned depositionEMIC |
| spellingShingle | Muhammad Salman Al Farisi Silvia Hertel Maik Wiemer Thomas Otto Aluminum Patterned Electroplating from AlCl<sub>3</sub>–[EMIm]Cl Ionic Liquid towards Microsystems Application Micromachines aluminum electro-chemical deposition ionic liquid recurrent galvanic pulse patterned deposition EMIC |
| title | Aluminum Patterned Electroplating from AlCl<sub>3</sub>–[EMIm]Cl Ionic Liquid towards Microsystems Application |
| title_full | Aluminum Patterned Electroplating from AlCl<sub>3</sub>–[EMIm]Cl Ionic Liquid towards Microsystems Application |
| title_fullStr | Aluminum Patterned Electroplating from AlCl<sub>3</sub>–[EMIm]Cl Ionic Liquid towards Microsystems Application |
| title_full_unstemmed | Aluminum Patterned Electroplating from AlCl<sub>3</sub>–[EMIm]Cl Ionic Liquid towards Microsystems Application |
| title_short | Aluminum Patterned Electroplating from AlCl<sub>3</sub>–[EMIm]Cl Ionic Liquid towards Microsystems Application |
| title_sort | aluminum patterned electroplating from alcl sub 3 sub emim cl ionic liquid towards microsystems application |
| topic | aluminum electro-chemical deposition ionic liquid recurrent galvanic pulse patterned deposition EMIC |
| url | https://www.mdpi.com/2072-666X/9/11/589 |
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