Application of e-Beam Voltage Contrast Technique for Overlay Improvement and Process Window Control in Multi-Patterning Interconnect Scheme

Interconnect development for the new technology node requires coordinated efforts of multiple module teams working to co-optimize patterning and metallization solutions to meet performance and yield, and reliability targets. This paper presents the results of interconnect patterning optimization to...

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Bibliographic Details
Main Authors: Linrong Yang, Runling Li, Ikai Hsu, Haiqiong Zhang, Jiadong Ren, Wenzhan Zhou, Linlin Sun, Yawen Xue, Wenchao Yang, Ruilin Zhang, Yefang Zhu, Yan Zhang, Guifeng Zhang, Yingying Fu, Shan Yin, Yujie Jia, Bo Yu, Tomasz Brozek
Format: Article
Language:English
Published: IEEE 2022-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9877843/