The Preparation of High-Volume Fraction SiC/Al Composites with High Thermal Conductivity by Vacuum Pressure Infiltration

The high-volume fraction SiC/Al composite is the new type of electronic packaging material, which plays an important role in the field of high-power integrated circuits. In this study, SiC/Al composites with high-volume fraction of SiC particles were prepared by vacuum pressure infiltration. The inf...

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Main Authors: Mengqin Chen, Yuelong Bai, Zhifeng Zhang, Haidong Zhao
Format: Article
Language:English
Published: MDPI AG 2021-05-01
Series:Crystals
Subjects:
Online Access:https://www.mdpi.com/2073-4352/11/5/515
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author Mengqin Chen
Yuelong Bai
Zhifeng Zhang
Haidong Zhao
author_facet Mengqin Chen
Yuelong Bai
Zhifeng Zhang
Haidong Zhao
author_sort Mengqin Chen
collection DOAJ
description The high-volume fraction SiC/Al composite is the new type of electronic packaging material, which plays an important role in the field of high-power integrated circuits. In this study, SiC/Al composites with high-volume fraction of SiC particles were prepared by vacuum pressure infiltration. The influence of SiC particle size and NH<sub>4</sub>HCO<sub>3</sub> on the pores in the preform was explored, aiming to accurately adjust the volume fraction of SiC to meet the thermal performance requirements in different fields. In addition, the preform was infiltrated with different Al alloys, and the relationship between the porosity and thermal conductivity of SiC/Al was studied. For the SiC preform, the volume fraction of SiC can be adjusted regularly when 12 μm and 100 μm SiC particles are mixed in different proportions, and the volume fraction reaches the maximum when the proportion of coarse particles is about 77%. NH<sub>4</sub>HCO<sub>3</sub> is conducive to the connectivity of pores in the preform, and about 40 vol.% of NH<sub>4</sub>HCO<sub>3</sub> can effectively increase the porosity of the preform. Thermal conductivity is sensitive to the porosity of composites, especially in the range of 2.5–4.5%. A simple application of the Hasselman–Johnson model and a new thermal conductivity model, λ<sub>d</sub>, established in this article, offer a good agreement with the experimental results.
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spelling doaj.art-26f019165bb24f7b823058cba3af44832023-11-21T18:35:28ZengMDPI AGCrystals2073-43522021-05-0111551510.3390/cryst11050515The Preparation of High-Volume Fraction SiC/Al Composites with High Thermal Conductivity by Vacuum Pressure InfiltrationMengqin Chen0Yuelong Bai1Zhifeng Zhang2Haidong Zhao3National Engineering & Technology Research Center for Nonferrous Metals Composites, GRINM Group Co., Ltd., Beijing 100088, ChinaNational Engineering & Technology Research Center for Nonferrous Metals Composites, GRINM Group Co., Ltd., Beijing 100088, ChinaNational Engineering & Technology Research Center for Nonferrous Metals Composites, GRINM Group Co., Ltd., Beijing 100088, ChinaNational Engineering Research Center for Metallic Materials Net-Shape Forming, South China University of Technology, Guangzhou 510641, ChinaThe high-volume fraction SiC/Al composite is the new type of electronic packaging material, which plays an important role in the field of high-power integrated circuits. In this study, SiC/Al composites with high-volume fraction of SiC particles were prepared by vacuum pressure infiltration. The influence of SiC particle size and NH<sub>4</sub>HCO<sub>3</sub> on the pores in the preform was explored, aiming to accurately adjust the volume fraction of SiC to meet the thermal performance requirements in different fields. In addition, the preform was infiltrated with different Al alloys, and the relationship between the porosity and thermal conductivity of SiC/Al was studied. For the SiC preform, the volume fraction of SiC can be adjusted regularly when 12 μm and 100 μm SiC particles are mixed in different proportions, and the volume fraction reaches the maximum when the proportion of coarse particles is about 77%. NH<sub>4</sub>HCO<sub>3</sub> is conducive to the connectivity of pores in the preform, and about 40 vol.% of NH<sub>4</sub>HCO<sub>3</sub> can effectively increase the porosity of the preform. Thermal conductivity is sensitive to the porosity of composites, especially in the range of 2.5–4.5%. A simple application of the Hasselman–Johnson model and a new thermal conductivity model, λ<sub>d</sub>, established in this article, offer a good agreement with the experimental results.https://www.mdpi.com/2073-4352/11/5/515SiC/Alvolume fractioninfiltrationporethermal conductivity
spellingShingle Mengqin Chen
Yuelong Bai
Zhifeng Zhang
Haidong Zhao
The Preparation of High-Volume Fraction SiC/Al Composites with High Thermal Conductivity by Vacuum Pressure Infiltration
Crystals
SiC/Al
volume fraction
infiltration
pore
thermal conductivity
title The Preparation of High-Volume Fraction SiC/Al Composites with High Thermal Conductivity by Vacuum Pressure Infiltration
title_full The Preparation of High-Volume Fraction SiC/Al Composites with High Thermal Conductivity by Vacuum Pressure Infiltration
title_fullStr The Preparation of High-Volume Fraction SiC/Al Composites with High Thermal Conductivity by Vacuum Pressure Infiltration
title_full_unstemmed The Preparation of High-Volume Fraction SiC/Al Composites with High Thermal Conductivity by Vacuum Pressure Infiltration
title_short The Preparation of High-Volume Fraction SiC/Al Composites with High Thermal Conductivity by Vacuum Pressure Infiltration
title_sort preparation of high volume fraction sic al composites with high thermal conductivity by vacuum pressure infiltration
topic SiC/Al
volume fraction
infiltration
pore
thermal conductivity
url https://www.mdpi.com/2073-4352/11/5/515
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