Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings
Crystalline and amorphous cobalt-phosphorus (Co-P) coatings have their own advantages in interfacial diffusion resistance and mechanical ductility of solder joints, respectively, but it cannot be better at both. In this work, the hybrid crystalline-amorphous Co-P coating (Co-9.1 at.% P) was fabricat...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2022-12-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127522010073 |
| _version_ | 1811292651774803968 |
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| author | Shuang Liu Limin Ma Cheng Zhen Yishu Wang Dan Li Fu Guo |
| author_facet | Shuang Liu Limin Ma Cheng Zhen Yishu Wang Dan Li Fu Guo |
| author_sort | Shuang Liu |
| collection | DOAJ |
| description | Crystalline and amorphous cobalt-phosphorus (Co-P) coatings have their own advantages in interfacial diffusion resistance and mechanical ductility of solder joints, respectively, but it cannot be better at both. In this work, the hybrid crystalline-amorphous Co-P coating (Co-9.1 at.% P) was fabricated and applied on the Cu/Sn interface by controlling the crystallinity through compositional design. Combining the advantages of crystalline and amorphous Co-P, strategies for solder joints with high shear strength, ductile intermetallic compounds (IMCs) and slow interface consumption was proposed. The evolution, microstructure, phase, and mechanical properties of the Co-Sn, Co-Sn-P and P-rich layers in solid-state diffusion were systematically characterized and tested by means of SEM, EPMA, EBSD, TEM, nanoindentation, and shear test. It was found that the hybrid Co-P coating achieved a low consumption rate, 14.2 nm/h, attributing to the partially crystalline structure and the Co-Sn-P exfoliation behavior. In addition, solder joints containing large-thickness ductile Co-Sn IMCs, 3.2–3.6 GPa of hardness, was established. The shear strength after aging reached 75.4 MPa relying on the large thickness of Co-Sn IMCs. Severe mechanical loads would be able to be withstand by virtue of the plastic deformation of ductile IMCs. Hybrid crystalline-amorphous Co-P would be a promising interface material in microelectronic packaging. |
| first_indexed | 2024-04-13T04:49:28Z |
| format | Article |
| id | doaj.art-27b9072fd36f4dc8b4237515c0998b46 |
| institution | Directory Open Access Journal |
| issn | 0264-1275 |
| language | English |
| last_indexed | 2024-04-13T04:49:28Z |
| publishDate | 2022-12-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Materials & Design |
| spelling | doaj.art-27b9072fd36f4dc8b4237515c0998b462022-12-22T03:01:44ZengElsevierMaterials & Design0264-12752022-12-01224111385Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatingsShuang Liu0Limin Ma1Cheng Zhen2Yishu Wang3Dan Li4Fu Guo5Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, People’s Republic of China; Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing 100124, People’s Republic of ChinaFaculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, People’s Republic of China; Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing 100124, People’s Republic of China; Corresponding authors at: Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, People’s Republic of China.Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, People’s Republic of China; Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing 100124, People’s Republic of ChinaFaculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, People’s Republic of China; Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing 100124, People’s Republic of ChinaFaculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, People’s Republic of China; Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing 100124, People’s Republic of ChinaFaculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, People’s Republic of China; Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing 100124, People’s Republic of China; College of Robotics, Beijing Union University, Beijing 100101, People’s Republic of China; Corresponding authors at: Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, People’s Republic of China.Crystalline and amorphous cobalt-phosphorus (Co-P) coatings have their own advantages in interfacial diffusion resistance and mechanical ductility of solder joints, respectively, but it cannot be better at both. In this work, the hybrid crystalline-amorphous Co-P coating (Co-9.1 at.% P) was fabricated and applied on the Cu/Sn interface by controlling the crystallinity through compositional design. Combining the advantages of crystalline and amorphous Co-P, strategies for solder joints with high shear strength, ductile intermetallic compounds (IMCs) and slow interface consumption was proposed. The evolution, microstructure, phase, and mechanical properties of the Co-Sn, Co-Sn-P and P-rich layers in solid-state diffusion were systematically characterized and tested by means of SEM, EPMA, EBSD, TEM, nanoindentation, and shear test. It was found that the hybrid Co-P coating achieved a low consumption rate, 14.2 nm/h, attributing to the partially crystalline structure and the Co-Sn-P exfoliation behavior. In addition, solder joints containing large-thickness ductile Co-Sn IMCs, 3.2–3.6 GPa of hardness, was established. The shear strength after aging reached 75.4 MPa relying on the large thickness of Co-Sn IMCs. Severe mechanical loads would be able to be withstand by virtue of the plastic deformation of ductile IMCs. Hybrid crystalline-amorphous Co-P would be a promising interface material in microelectronic packaging.http://www.sciencedirect.com/science/article/pii/S0264127522010073Hybrid coatingCobalt-phosphorusIntermetallic compoundExfoliationDiffusion resistanceDuctility |
| spellingShingle | Shuang Liu Limin Ma Cheng Zhen Yishu Wang Dan Li Fu Guo Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings Materials & Design Hybrid coating Cobalt-phosphorus Intermetallic compound Exfoliation Diffusion resistance Ductility |
| title | Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings |
| title_full | Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings |
| title_fullStr | Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings |
| title_full_unstemmed | Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings |
| title_short | Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings |
| title_sort | strategies for solder joints with high shear strength slow interfacial consumption ductile intermetallic compounds using hybrid crystalline amorphous co p coatings |
| topic | Hybrid coating Cobalt-phosphorus Intermetallic compound Exfoliation Diffusion resistance Ductility |
| url | http://www.sciencedirect.com/science/article/pii/S0264127522010073 |
| work_keys_str_mv | AT shuangliu strategiesforsolderjointswithhighshearstrengthslowinterfacialconsumptionductileintermetalliccompoundsusinghybridcrystallineamorphouscopcoatings AT liminma strategiesforsolderjointswithhighshearstrengthslowinterfacialconsumptionductileintermetalliccompoundsusinghybridcrystallineamorphouscopcoatings AT chengzhen strategiesforsolderjointswithhighshearstrengthslowinterfacialconsumptionductileintermetalliccompoundsusinghybridcrystallineamorphouscopcoatings AT yishuwang strategiesforsolderjointswithhighshearstrengthslowinterfacialconsumptionductileintermetalliccompoundsusinghybridcrystallineamorphouscopcoatings AT danli strategiesforsolderjointswithhighshearstrengthslowinterfacialconsumptionductileintermetalliccompoundsusinghybridcrystallineamorphouscopcoatings AT fuguo strategiesforsolderjointswithhighshearstrengthslowinterfacialconsumptionductileintermetalliccompoundsusinghybridcrystallineamorphouscopcoatings |