Simultaneous manipulations of thermal expansion and conductivity in symbiotic ScTaO<sub>4</sub>/SmTaO<sub>4</sub> composites via multiscale effects

<p>Effective manipulations of thermal expansion and conductivity are significant for improving operational performances of protective coatings, thermoelectric, and radiators. This work uncovers determinant mechanisms of the thermal expansion and conductivity of symbiotic ScTaO<sub>4</...

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Main Authors: Lin Chen, Jiankun Wang, Baihui Li, Keren Luo, Jing Feng
Format: Article
Language:English
Published: Tsinghua University Press 2023-08-01
Series:Journal of Advanced Ceramics
Subjects:
Online Access:https://www.sciopen.com/article/10.26599/JAC.2023.9220776
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author Lin Chen
Jiankun Wang
Baihui Li
Keren Luo
Jing Feng
author_facet Lin Chen
Jiankun Wang
Baihui Li
Keren Luo
Jing Feng
author_sort Lin Chen
collection DOAJ
description <p>Effective manipulations of thermal expansion and conductivity are significant for improving operational performances of protective coatings, thermoelectric, and radiators. This work uncovers determinant mechanisms of the thermal expansion and conductivity of symbiotic ScTaO<sub>4</sub>/SmTaO<sub>4</sub> composites as thermal/environmental barrier coatings (T/EBCs), and we consider the effects of interface stress and thermal resistance. The weak bonding and interface stress among composite grains manipulate coefficient of thermal expansion (CTE) stretching from 6.4×10<sup>−6</sup> to 10.7×10<sup>−6</sup> K<sup>−1</sup> at 1300 ℃, which gets close to that of substrates in T/EBC systems. The multiscale effects, including phonon scattering at the interface, mitigation of the phonon speed (<italic>v</italic><sub>p</sub>), and lattice point defects, synergistically depress phonon thermal transports, and we estimate the proportions of different parts. The interface thermal resistance (<italic>R</italic>) reduces the thermal conductivity (<italic>k</italic>) by depressing phonon speed and scattering phonons because of different acoustic properties and weak bonding between symbiotic ScTaO<sub>4</sub> and SmTaO<sub>4</sub> ceramics in the composites. This study proves that CTE of tantalates can be artificially regulated to match those of different substrates to expand their applications, and the uncovered multiscale effects can be used to manipulate thermal transports of various materials.</p>
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spelling doaj.art-27cc799693d145d0a8ca3d042e44fe852023-10-10T11:18:12ZengTsinghua University PressJournal of Advanced Ceramics2226-41082227-85082023-08-011281625164010.26599/JAC.2023.9220776Simultaneous manipulations of thermal expansion and conductivity in symbiotic ScTaO<sub>4</sub>/SmTaO<sub>4</sub> composites via multiscale effectsLin ChenJiankun WangBaihui LiKeren LuoJing Feng<p>Effective manipulations of thermal expansion and conductivity are significant for improving operational performances of protective coatings, thermoelectric, and radiators. This work uncovers determinant mechanisms of the thermal expansion and conductivity of symbiotic ScTaO<sub>4</sub>/SmTaO<sub>4</sub> composites as thermal/environmental barrier coatings (T/EBCs), and we consider the effects of interface stress and thermal resistance. The weak bonding and interface stress among composite grains manipulate coefficient of thermal expansion (CTE) stretching from 6.4×10<sup>−6</sup> to 10.7×10<sup>−6</sup> K<sup>−1</sup> at 1300 ℃, which gets close to that of substrates in T/EBC systems. The multiscale effects, including phonon scattering at the interface, mitigation of the phonon speed (<italic>v</italic><sub>p</sub>), and lattice point defects, synergistically depress phonon thermal transports, and we estimate the proportions of different parts. The interface thermal resistance (<italic>R</italic>) reduces the thermal conductivity (<italic>k</italic>) by depressing phonon speed and scattering phonons because of different acoustic properties and weak bonding between symbiotic ScTaO<sub>4</sub> and SmTaO<sub>4</sub> ceramics in the composites. This study proves that CTE of tantalates can be artificially regulated to match those of different substrates to expand their applications, and the uncovered multiscale effects can be used to manipulate thermal transports of various materials.</p>https://www.sciopen.com/article/10.26599/JAC.2023.9220776thermal managementcoefficient of thermal expansion (cte)interface thermal resistance (<italic>r</italic>)thermal stress (<italic>σ</italic>)thermal/environmental barrier coatings (t/ebcs)
spellingShingle Lin Chen
Jiankun Wang
Baihui Li
Keren Luo
Jing Feng
Simultaneous manipulations of thermal expansion and conductivity in symbiotic ScTaO<sub>4</sub>/SmTaO<sub>4</sub> composites via multiscale effects
Journal of Advanced Ceramics
thermal management
coefficient of thermal expansion (cte)
interface thermal resistance (<italic>r</italic>)
thermal stress (<italic>σ</italic>)
thermal/environmental barrier coatings (t/ebcs)
title Simultaneous manipulations of thermal expansion and conductivity in symbiotic ScTaO<sub>4</sub>/SmTaO<sub>4</sub> composites via multiscale effects
title_full Simultaneous manipulations of thermal expansion and conductivity in symbiotic ScTaO<sub>4</sub>/SmTaO<sub>4</sub> composites via multiscale effects
title_fullStr Simultaneous manipulations of thermal expansion and conductivity in symbiotic ScTaO<sub>4</sub>/SmTaO<sub>4</sub> composites via multiscale effects
title_full_unstemmed Simultaneous manipulations of thermal expansion and conductivity in symbiotic ScTaO<sub>4</sub>/SmTaO<sub>4</sub> composites via multiscale effects
title_short Simultaneous manipulations of thermal expansion and conductivity in symbiotic ScTaO<sub>4</sub>/SmTaO<sub>4</sub> composites via multiscale effects
title_sort simultaneous manipulations of thermal expansion and conductivity in symbiotic sctao sub 4 sub smtao sub 4 sub composites via multiscale effects
topic thermal management
coefficient of thermal expansion (cte)
interface thermal resistance (<italic>r</italic>)
thermal stress (<italic>σ</italic>)
thermal/environmental barrier coatings (t/ebcs)
url https://www.sciopen.com/article/10.26599/JAC.2023.9220776
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