The Design, Fabrication and Characterization of a Transparent Atom Chip
This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reser...
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| Format: | Article |
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MDPI AG
2014-06-01
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| Series: | Sensors |
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| Online Access: | http://www.mdpi.com/1424-8220/14/6/10292 |
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| author | Ho-Chiao Chuang Chia-Shiuan Huang Hung-Pin Chen Chi-Sheng Huang Yu-Hsin Lin |
| author_facet | Ho-Chiao Chuang Chia-Shiuan Huang Hung-Pin Chen Chi-Sheng Huang Yu-Hsin Lin |
| author_sort | Ho-Chiao Chuang |
| collection | DOAJ |
| description | This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm) without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments. |
| first_indexed | 2024-04-13T01:14:12Z |
| format | Article |
| id | doaj.art-27eddf3cbde74582ab1ca07db4f92cb7 |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2024-04-13T01:14:12Z |
| publishDate | 2014-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-27eddf3cbde74582ab1ca07db4f92cb72022-12-22T03:09:01ZengMDPI AGSensors1424-82202014-06-01146102921030510.3390/s140610292s140610292The Design, Fabrication and Characterization of a Transparent Atom ChipHo-Chiao Chuang0Chia-Shiuan Huang1Hung-Pin Chen2Chi-Sheng Huang3Yu-Hsin Lin4Department of Mechanical Engineering, National Taipei University of Technology, Taipei 10608, TaiwanDepartment of Mechanical Engineering, National Taipei University of Technology, Taipei 10608, TaiwanVacuum Technology and Nanofabrication Division, Instrument Technology Research Center, National Applied Research Laboratories, Hsin-Chu 30076, TaiwanOpto-Electro-Mechanical System Division, Instrument Technology Research Center, National Applied Research Laboratories, Hsin-Chu 30076, TaiwanVacuum Technology and Nanofabrication Division, Instrument Technology Research Center, National Applied Research Laboratories, Hsin-Chu 30076, TaiwanThis study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm) without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments.http://www.mdpi.com/1424-8220/14/6/10292glass substratetransparent atom chipheat dissipation |
| spellingShingle | Ho-Chiao Chuang Chia-Shiuan Huang Hung-Pin Chen Chi-Sheng Huang Yu-Hsin Lin The Design, Fabrication and Characterization of a Transparent Atom Chip Sensors glass substrate transparent atom chip heat dissipation |
| title | The Design, Fabrication and Characterization of a Transparent Atom Chip |
| title_full | The Design, Fabrication and Characterization of a Transparent Atom Chip |
| title_fullStr | The Design, Fabrication and Characterization of a Transparent Atom Chip |
| title_full_unstemmed | The Design, Fabrication and Characterization of a Transparent Atom Chip |
| title_short | The Design, Fabrication and Characterization of a Transparent Atom Chip |
| title_sort | design fabrication and characterization of a transparent atom chip |
| topic | glass substrate transparent atom chip heat dissipation |
| url | http://www.mdpi.com/1424-8220/14/6/10292 |
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