Precision Grinding Technology of Silicon Carbide (SiC) Ceramics by Longitudinal Torsional Ultrasonic Vibrations

Precision Grinding Technology of Silicon Carbide (SiC) Ceramics by Longitudinal Torsional Ultrasonic Vibrations

Silicon carbide (SiC) ceramic material has become the most promising third-generation semiconductor material for its excellent mechanical properties at room temperature and high temperature. However, SiC ceramic machining has serious tool wear, low machining efficiency, poor machining quality and ot...

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Bibliographic Details
Main Authors: Zejiu Ye, Xu Wen, Weiqiang Wan, Fuchu Liu, Wei Bai, Chao Xu, Hui Chen, Pan Gong, Guangchao Han
Format: Article
Language:English
Published: MDPI AG 2023-08-01
Series:Materials
Subjects:
longitudinal torsional ultrasonic vibrations
silicon carbide ceramics
grinding removal mechanism
cutting force prediction model
process parameter optimization
Online Access:https://www.mdpi.com/1996-1944/16/16/5572

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