Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temp...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-02-01
|
| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/16/5/1852 |
| _version_ | 1797614938316865536 |
|---|---|
| author | Aimi Noorliyana Hashim Mohd Arif Anuar Mohd Salleh Muhammad Mahyiddin Ramli Mohd Mustafa Al Bakri Abdullah Andrei Victor Sandu Petrica Vizureanu Ioan Gabriel Sandu |
| author_facet | Aimi Noorliyana Hashim Mohd Arif Anuar Mohd Salleh Muhammad Mahyiddin Ramli Mohd Mustafa Al Bakri Abdullah Andrei Victor Sandu Petrica Vizureanu Ioan Gabriel Sandu |
| author_sort | Aimi Noorliyana Hashim |
| collection | DOAJ |
| description | This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temperature and annealed under 50 °C and 105 °C conditions. Through the observations, the significant outcome was the suppressing effect of Sn0.7Cu0.05Ni on Sn whisker growth in terms of density and length reduction. The fast atomic diffusion of isothermal annealing consequently reduced the stress gradient of Sn whisker growth on the Sn0.7Cu0.05Ni solder joint. It was also established that the smaller (Cu,Ni)<sub>6</sub>Sn<sub>5</sub> grain size and stability characteristic of hexagonal η-Cu<sub>6</sub>Sn<sub>5</sub> considerably contribute to the residual stress diminished in the (Cu,Ni)<sub>6</sub>Sn<sub>5</sub> IMC interfacial layer and are able to suppress the growth of Sn whiskers on the Sn0.7Cu0.05Ni solder joint. The findings of this study provide environmental acceptance with the aim of suppressing Sn whisker growth and upsurging the reliability of the Sn0.7Cu0.05Ni solder joint at the electronic-device-operation temperature. |
| first_indexed | 2024-03-11T07:19:22Z |
| format | Article |
| id | doaj.art-29b4481e7678437aa2c5f0c308ff8a72 |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-11T07:19:22Z |
| publishDate | 2023-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-29b4481e7678437aa2c5f0c308ff8a722023-11-17T08:03:48ZengMDPI AGMaterials1996-19442023-02-01165185210.3390/ma16051852Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder JointAimi Noorliyana Hashim0Mohd Arif Anuar Mohd Salleh1Muhammad Mahyiddin Ramli2Mohd Mustafa Al Bakri Abdullah3Andrei Victor Sandu4Petrica Vizureanu5Ioan Gabriel Sandu6Centre of Excellence Geopolymer and Green Technology, Universiti Malaysia Perlis (UniMAP), Taman Muhibah, Jejawi, Arau 02600, Perlis, MalaysiaCentre of Excellence Geopolymer and Green Technology, Universiti Malaysia Perlis (UniMAP), Taman Muhibah, Jejawi, Arau 02600, Perlis, MalaysiaSchool of Microelectronic Engineering, Pauh Putra Campus, Universiti Malaysia Perlis (UniMAP), Arau 02600, Perlis, MalaysiaCentre of Excellence Geopolymer and Green Technology, Universiti Malaysia Perlis (UniMAP), Taman Muhibah, Jejawi, Arau 02600, Perlis, MalaysiaFaculty of Materials Science and Engineering, Gheorghe Asachi Technical University of lasi, Blvd. D. Mangeron 71, 700050 Iasi, RomaniaFaculty of Materials Science and Engineering, Gheorghe Asachi Technical University of lasi, Blvd. D. Mangeron 71, 700050 Iasi, RomaniaFaculty of Materials Science and Engineering, Gheorghe Asachi Technical University of lasi, Blvd. D. Mangeron 71, 700050 Iasi, RomaniaThis paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temperature and annealed under 50 °C and 105 °C conditions. Through the observations, the significant outcome was the suppressing effect of Sn0.7Cu0.05Ni on Sn whisker growth in terms of density and length reduction. The fast atomic diffusion of isothermal annealing consequently reduced the stress gradient of Sn whisker growth on the Sn0.7Cu0.05Ni solder joint. It was also established that the smaller (Cu,Ni)<sub>6</sub>Sn<sub>5</sub> grain size and stability characteristic of hexagonal η-Cu<sub>6</sub>Sn<sub>5</sub> considerably contribute to the residual stress diminished in the (Cu,Ni)<sub>6</sub>Sn<sub>5</sub> IMC interfacial layer and are able to suppress the growth of Sn whiskers on the Sn0.7Cu0.05Ni solder joint. The findings of this study provide environmental acceptance with the aim of suppressing Sn whisker growth and upsurging the reliability of the Sn0.7Cu0.05Ni solder joint at the electronic-device-operation temperature.https://www.mdpi.com/1996-1944/16/5/1852Sn whiskerSn0.7Cu0.05NiIMC interfacial(Cu,Ni)<sub>6</sub>Sn<sub>5</sub>solder jointannealing |
| spellingShingle | Aimi Noorliyana Hashim Mohd Arif Anuar Mohd Salleh Muhammad Mahyiddin Ramli Mohd Mustafa Al Bakri Abdullah Andrei Victor Sandu Petrica Vizureanu Ioan Gabriel Sandu Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint Materials Sn whisker Sn0.7Cu0.05Ni IMC interfacial (Cu,Ni)<sub>6</sub>Sn<sub>5</sub> solder joint annealing |
| title | Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint |
| title_full | Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint |
| title_fullStr | Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint |
| title_full_unstemmed | Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint |
| title_short | Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint |
| title_sort | effect of isothermal annealing on sn whisker growth behavior of sn0 7cu0 05ni solder joint |
| topic | Sn whisker Sn0.7Cu0.05Ni IMC interfacial (Cu,Ni)<sub>6</sub>Sn<sub>5</sub> solder joint annealing |
| url | https://www.mdpi.com/1996-1944/16/5/1852 |
| work_keys_str_mv | AT aiminoorliyanahashim effectofisothermalannealingonsnwhiskergrowthbehaviorofsn07cu005nisolderjoint AT mohdarifanuarmohdsalleh effectofisothermalannealingonsnwhiskergrowthbehaviorofsn07cu005nisolderjoint AT muhammadmahyiddinramli effectofisothermalannealingonsnwhiskergrowthbehaviorofsn07cu005nisolderjoint AT mohdmustafaalbakriabdullah effectofisothermalannealingonsnwhiskergrowthbehaviorofsn07cu005nisolderjoint AT andreivictorsandu effectofisothermalannealingonsnwhiskergrowthbehaviorofsn07cu005nisolderjoint AT petricavizureanu effectofisothermalannealingonsnwhiskergrowthbehaviorofsn07cu005nisolderjoint AT ioangabrielsandu effectofisothermalannealingonsnwhiskergrowthbehaviorofsn07cu005nisolderjoint |