Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint

Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint

This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temp...

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Bibliographic Details
Main Authors:	Aimi Noorliyana Hashim, Mohd Arif Anuar Mohd Salleh, Muhammad Mahyiddin Ramli, Mohd Mustafa Al Bakri Abdullah, Andrei Victor Sandu, Petrica Vizureanu, Ioan Gabriel Sandu
Format:	Article
Language:	English
Published:	MDPI AG 2023-02-01
Series:	Materials
Subjects:	Sn whisker Sn0.7Cu0.05Ni IMC interfacial (Cu,Ni)<sub>6</sub>Sn<sub>5</sub> solder joint annealing
Online Access:	https://www.mdpi.com/1996-1944/16/5/1852

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