Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size
Nanoindentation morphologies of crystalline copper have been probed at the grain scale. Experimental tests have been conducted on nanocrystalline (NC), ultrafine-grained (UFG), and coarse-grained (CG) copper samples with a new Berkvoich indenter at the strain rate of 0.04/s without holding time at a...
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| Format: | Article |
| Language: | English |
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MDPI AG
2017-12-01
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| Series: | Crystals |
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| Online Access: | https://www.mdpi.com/2073-4352/8/1/9 |
| _version_ | 1798006943627870208 |
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| author | Jiangjiang Hu Yusheng Zhang Weiming Sun Taihua Zhang |
| author_facet | Jiangjiang Hu Yusheng Zhang Weiming Sun Taihua Zhang |
| author_sort | Jiangjiang Hu |
| collection | DOAJ |
| description | Nanoindentation morphologies of crystalline copper have been probed at the grain scale. Experimental tests have been conducted on nanocrystalline (NC), ultrafine-grained (UFG), and coarse-grained (CG) copper samples with a new Berkvoich indenter at the strain rate of 0.04/s without holding time at an indentation depth of 2000 nm at room temperature. As the grain size increases, the height of the pile-up around the residual indentation increases and then exhibits a slightly decrease in the CG Cu. The maximum of the pile-up in the CG Cu obviously deviates from the center of the indenter sides. Our analysis has revealed that the dislocation motion and GB activities in the NC Cu, some cross- and multiple-slip dislocations inside the larger grain in the UFG Cu, and forest dislocations from the intragranular Frank-Read sources in the CG Cu would directly induce this distinct pile-up effect. |
| first_indexed | 2024-04-11T13:02:26Z |
| format | Article |
| id | doaj.art-29d3bad433ca4e66b15f35afebc8f35d |
| institution | Directory Open Access Journal |
| issn | 2073-4352 |
| language | English |
| last_indexed | 2024-04-11T13:02:26Z |
| publishDate | 2017-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Crystals |
| spelling | doaj.art-29d3bad433ca4e66b15f35afebc8f35d2022-12-22T04:22:52ZengMDPI AGCrystals2073-43522017-12-0181910.3390/cryst8010009cryst8010009Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain SizeJiangjiang Hu0Yusheng Zhang1Weiming Sun2Taihua Zhang3College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, ChinaAdvanced Materials Research Center, Northwest Institute for Non-Ferrous Metal Research, Xi’an 710016, ChinaKey Laboratory of Automobile Materials, College of Materials Science and Engineering Jilin University, Nanling Campus, Changchun 130025, ChinaCollege of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, ChinaNanoindentation morphologies of crystalline copper have been probed at the grain scale. Experimental tests have been conducted on nanocrystalline (NC), ultrafine-grained (UFG), and coarse-grained (CG) copper samples with a new Berkvoich indenter at the strain rate of 0.04/s without holding time at an indentation depth of 2000 nm at room temperature. As the grain size increases, the height of the pile-up around the residual indentation increases and then exhibits a slightly decrease in the CG Cu. The maximum of the pile-up in the CG Cu obviously deviates from the center of the indenter sides. Our analysis has revealed that the dislocation motion and GB activities in the NC Cu, some cross- and multiple-slip dislocations inside the larger grain in the UFG Cu, and forest dislocations from the intragranular Frank-Read sources in the CG Cu would directly induce this distinct pile-up effect.https://www.mdpi.com/2073-4352/8/1/9nanoindentationpile-up effectgrain sizedislocation motiongrain boundary activities |
| spellingShingle | Jiangjiang Hu Yusheng Zhang Weiming Sun Taihua Zhang Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size Crystals nanoindentation pile-up effect grain size dislocation motion grain boundary activities |
| title | Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size |
| title_full | Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size |
| title_fullStr | Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size |
| title_full_unstemmed | Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size |
| title_short | Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size |
| title_sort | nanoindentation induced pile up in the residual impression of crystalline cu with different grain size |
| topic | nanoindentation pile-up effect grain size dislocation motion grain boundary activities |
| url | https://www.mdpi.com/2073-4352/8/1/9 |
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