A review: Suppression of the solidification cracks in the laser welding process by controlling the grain structure and chemical compositions

Laser beam welding of miscellaneous material combinations is an effective joining technology useful for diverse industrial applications because it can provide high speed, flexibility, and precision. However, welding defects like solidification cracking are some of the challenges in the joining proce...

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Main Authors: Mohammadhossein Norouzian, Mahdi Amne Elahi, Peter Plapper
Format: Article
Language:English
Published: Elsevier 2023-06-01
Series:Journal of Advanced Joining Processes
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2666330923000018
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author Mohammadhossein Norouzian
Mahdi Amne Elahi
Peter Plapper
author_facet Mohammadhossein Norouzian
Mahdi Amne Elahi
Peter Plapper
author_sort Mohammadhossein Norouzian
collection DOAJ
description Laser beam welding of miscellaneous material combinations is an effective joining technology useful for diverse industrial applications because it can provide high speed, flexibility, and precision. However, welding defects like solidification cracking are some of the challenges in the joining process. The past decade has seen an extended effort to deal with this issue in many studies. However, there remains to be more comprehensive research regarding preventive procedures for solidification cracking by changing the grain structure. Following a thorough understanding of the solidification crack mechanism theories, we reviewed recent research on the critical role of metallurgical factors in the solidification cracks during laser welding. It considers the influence of the grain structure, intermetallic compounds, and laser welding parameters to propose preventive procedures to suppress the solidification cracks. Recent achievements show grain refiners, laser beam oscillation, ultrasonic vibration, and implementation of double laser sources are the main strategies that suppress or minimize solidification cracks. Furthermore, in laser beam welding of dissimilar materials, like steel-hard metal and copper-aluminum, brittle intermetallic compounds are recognized as one of the main reasons for the solidification crack susceptible increment. Recent approaches to overcome the formation or reduce the number of intermetallic compounds through various laser parameters and setups are discussed.
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spelling doaj.art-2a65bc70899e4ffba8bd9da9a399b9752023-01-21T04:21:41ZengElsevierJournal of Advanced Joining Processes2666-33092023-06-017100139A review: Suppression of the solidification cracks in the laser welding process by controlling the grain structure and chemical compositionsMohammadhossein Norouzian0Mahdi Amne Elahi1Peter Plapper2Corresponding author.; University of Luxembourg, 6, rue Coudenhove Kalergi, L-1359, LuxembourgUniversity of Luxembourg, 6, rue Coudenhove Kalergi, L-1359, LuxembourgUniversity of Luxembourg, 6, rue Coudenhove Kalergi, L-1359, LuxembourgLaser beam welding of miscellaneous material combinations is an effective joining technology useful for diverse industrial applications because it can provide high speed, flexibility, and precision. However, welding defects like solidification cracking are some of the challenges in the joining process. The past decade has seen an extended effort to deal with this issue in many studies. However, there remains to be more comprehensive research regarding preventive procedures for solidification cracking by changing the grain structure. Following a thorough understanding of the solidification crack mechanism theories, we reviewed recent research on the critical role of metallurgical factors in the solidification cracks during laser welding. It considers the influence of the grain structure, intermetallic compounds, and laser welding parameters to propose preventive procedures to suppress the solidification cracks. Recent achievements show grain refiners, laser beam oscillation, ultrasonic vibration, and implementation of double laser sources are the main strategies that suppress or minimize solidification cracks. Furthermore, in laser beam welding of dissimilar materials, like steel-hard metal and copper-aluminum, brittle intermetallic compounds are recognized as one of the main reasons for the solidification crack susceptible increment. Recent approaches to overcome the formation or reduce the number of intermetallic compounds through various laser parameters and setups are discussed.http://www.sciencedirect.com/science/article/pii/S2666330923000018Solidification crackLaser weldingGrain structureChemical compoundsBrittle intermetallic compoundsSuppression of cracks
spellingShingle Mohammadhossein Norouzian
Mahdi Amne Elahi
Peter Plapper
A review: Suppression of the solidification cracks in the laser welding process by controlling the grain structure and chemical compositions
Journal of Advanced Joining Processes
Solidification crack
Laser welding
Grain structure
Chemical compounds
Brittle intermetallic compounds
Suppression of cracks
title A review: Suppression of the solidification cracks in the laser welding process by controlling the grain structure and chemical compositions
title_full A review: Suppression of the solidification cracks in the laser welding process by controlling the grain structure and chemical compositions
title_fullStr A review: Suppression of the solidification cracks in the laser welding process by controlling the grain structure and chemical compositions
title_full_unstemmed A review: Suppression of the solidification cracks in the laser welding process by controlling the grain structure and chemical compositions
title_short A review: Suppression of the solidification cracks in the laser welding process by controlling the grain structure and chemical compositions
title_sort review suppression of the solidification cracks in the laser welding process by controlling the grain structure and chemical compositions
topic Solidification crack
Laser welding
Grain structure
Chemical compounds
Brittle intermetallic compounds
Suppression of cracks
url http://www.sciencedirect.com/science/article/pii/S2666330923000018
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