Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns
For the improvement of the performance and function of electronic textiles (e-textiles), methods for electronic component mounting of textile circuits with electrical and mechanical durability are necessary. This manuscript presents a component mounting method for durable e-textiles, with a simpler...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-02-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/11/2/209 |
| _version_ | 1811330949276762112 |
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| author | Tomoya Koshi Ken-ichi Nomura Manabu Yoshida |
| author_facet | Tomoya Koshi Ken-ichi Nomura Manabu Yoshida |
| author_sort | Tomoya Koshi |
| collection | DOAJ |
| description | For the improvement of the performance and function of electronic textiles (e-textiles), methods for electronic component mounting of textile circuits with electrical and mechanical durability are necessary. This manuscript presents a component mounting method for durable e-textiles, with a simpler implementation and increased compatibility with conventional electronics manufacturing processes. In this process, conductive patterns are directly formed on a textile by the printing of conductive ink with deep permeation and, then, components are directly soldered on the patterns. The stiffness of patterns is enhanced by the deep permeation, and the enhancement prevents electrical and mechanical breakages due to the stress concentration between the pattern and solder. This allows components to be directly mounting on textile circuits with electrical and mechanical durability. In this study, a chip resistor was soldered on printed patterns with different permeation depths, and the durability of the samples were evaluated by measuring the variation in resistance based on cyclic tensile tests and shear tests. The experiments confirmed that the durability was improved by the deep permeation, and that the samples with solder and deep permeation exhibited superior durability as compared with the samples based on commercially available elastic conductive adhesives for component mounting. In addition, a radio circuit was fabricated on a textile to demonstrate that various types of components can be mounted based on the proposed methods. |
| first_indexed | 2024-04-13T16:11:38Z |
| format | Article |
| id | doaj.art-2ab2c655df5e4f488d6a75ca9ac9770e |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-04-13T16:11:38Z |
| publishDate | 2020-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-2ab2c655df5e4f488d6a75ca9ac9770e2022-12-22T02:40:12ZengMDPI AGMicromachines2072-666X2020-02-0111220910.3390/mi11020209mi11020209Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive PatternsTomoya Koshi0Ken-ichi Nomura1Manabu Yoshida2Sensing System Research Center (SSRC), National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba, Ibaraki 305-8565, JapanSensing System Research Center (SSRC), National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba, Ibaraki 305-8565, JapanSensing System Research Center (SSRC), National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba, Ibaraki 305-8565, JapanFor the improvement of the performance and function of electronic textiles (e-textiles), methods for electronic component mounting of textile circuits with electrical and mechanical durability are necessary. This manuscript presents a component mounting method for durable e-textiles, with a simpler implementation and increased compatibility with conventional electronics manufacturing processes. In this process, conductive patterns are directly formed on a textile by the printing of conductive ink with deep permeation and, then, components are directly soldered on the patterns. The stiffness of patterns is enhanced by the deep permeation, and the enhancement prevents electrical and mechanical breakages due to the stress concentration between the pattern and solder. This allows components to be directly mounting on textile circuits with electrical and mechanical durability. In this study, a chip resistor was soldered on printed patterns with different permeation depths, and the durability of the samples were evaluated by measuring the variation in resistance based on cyclic tensile tests and shear tests. The experiments confirmed that the durability was improved by the deep permeation, and that the samples with solder and deep permeation exhibited superior durability as compared with the samples based on commercially available elastic conductive adhesives for component mounting. In addition, a radio circuit was fabricated on a textile to demonstrate that various types of components can be mounted based on the proposed methods.https://www.mdpi.com/2072-666X/11/2/209e-textileselectronic component mountingprintingsolderingconducive ink |
| spellingShingle | Tomoya Koshi Ken-ichi Nomura Manabu Yoshida Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns Micromachines e-textiles electronic component mounting printing soldering conducive ink |
| title | Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns |
| title_full | Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns |
| title_fullStr | Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns |
| title_full_unstemmed | Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns |
| title_short | Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns |
| title_sort | electronic component mounting for durable e textiles direct soldering of components onto textile based deeply permeated conductive patterns |
| topic | e-textiles electronic component mounting printing soldering conducive ink |
| url | https://www.mdpi.com/2072-666X/11/2/209 |
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