Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns

Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns

For the improvement of the performance and function of electronic textiles (e-textiles), methods for electronic component mounting of textile circuits with electrical and mechanical durability are necessary. This manuscript presents a component mounting method for durable e-textiles, with a simpler...

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Bibliographic Details
Main Authors: Tomoya Koshi, Ken-ichi Nomura, Manabu Yoshida
Format: Article
Language:English
Published: MDPI AG 2020-02-01
Series:Micromachines
Subjects:
e-textiles
electronic component mounting
printing
soldering
conducive ink
Online Access:https://www.mdpi.com/2072-666X/11/2/209

Internet

https://www.mdpi.com/2072-666X/11/2/209

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