ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints
This paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections. The curing kinetics of ACA is first presented and then a curing degree (α) relationship between curing temperature T and c...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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IEEE
2019-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8932490/ |
| _version_ | 1819276389783699456 |
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| author | Guanghua Wu Meixian Jiang Diganta Das Michael Pecht |
| author_facet | Guanghua Wu Meixian Jiang Diganta Das Michael Pecht |
| author_sort | Guanghua Wu |
| collection | DOAJ |
| description | This paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections. The curing kinetics of ACA is first presented and then a curing degree (α) relationship between curing temperature T and curing time t is established. The influence of different curing degree states on the interfacial shear strength is then reported, including the effect of degree of curing on shear strength both before and after hygro-thermal aging. |
| first_indexed | 2024-12-23T23:39:27Z |
| format | Article |
| id | doaj.art-2ab8b1b9b5fe489aad4211847754643b |
| institution | Directory Open Access Journal |
| issn | 2169-3536 |
| language | English |
| last_indexed | 2024-12-23T23:39:27Z |
| publishDate | 2019-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Access |
| spelling | doaj.art-2ab8b1b9b5fe489aad4211847754643b2022-12-21T17:25:44ZengIEEEIEEE Access2169-35362019-01-01718290618291510.1109/ACCESS.2019.29593248932490ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of JointsGuanghua Wu0https://orcid.org/0000-0002-5327-2881Meixian Jiang1https://orcid.org/0000-0001-7639-5385Diganta Das2https://orcid.org/0000-0001-9097-2118Michael Pecht3https://orcid.org/0000-0003-1126-8662College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, ChinaCollege of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, ChinaCenter for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, Maryland, USACenter for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, Maryland, USAThis paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections. The curing kinetics of ACA is first presented and then a curing degree (α) relationship between curing temperature T and curing time t is established. The influence of different curing degree states on the interfacial shear strength is then reported, including the effect of degree of curing on shear strength both before and after hygro-thermal aging.https://ieeexplore.ieee.org/document/8932490/Curing degreeACAparameters optimizationshear strength |
| spellingShingle | Guanghua Wu Meixian Jiang Diganta Das Michael Pecht ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints IEEE Access Curing degree ACA parameters optimization shear strength |
| title | ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints |
| title_full | ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints |
| title_fullStr | ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints |
| title_full_unstemmed | ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints |
| title_short | ACA Curing Process Optimization Based on Curing Degree Considering Shear Strength of Joints |
| title_sort | aca curing process optimization based on curing degree considering shear strength of joints |
| topic | Curing degree ACA parameters optimization shear strength |
| url | https://ieeexplore.ieee.org/document/8932490/ |
| work_keys_str_mv | AT guanghuawu acacuringprocessoptimizationbasedoncuringdegreeconsideringshearstrengthofjoints AT meixianjiang acacuringprocessoptimizationbasedoncuringdegreeconsideringshearstrengthofjoints AT digantadas acacuringprocessoptimizationbasedoncuringdegreeconsideringshearstrengthofjoints AT michaelpecht acacuringprocessoptimizationbasedoncuringdegreeconsideringshearstrengthofjoints |