A Wireless, Passive Sensor for Quantifying Packaged Food Quality

This paper describes the fabrication of a wireless, passive sensor based on aninductive-capacitive resonant circuit, and its application for in situ monitoring of thequality of dry, packaged food such as cereals, and fried and baked snacks. The sensor ismade of a planar inductor and capacitor printe...

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Bibliographic Details
Main Authors: Keat Ghee Ong, Brandon D. Pereles, Ranyuan Shao, Wen Ni Ng, Ee Lim Tan
Format: Article
Language:English
Published: MDPI AG 2007-09-01
Series:Sensors
Subjects:
Online Access:http://www.mdpi.com/1424-8220/7/9/1747/

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