A Wireless, Passive Sensor for Quantifying Packaged Food Quality
This paper describes the fabrication of a wireless, passive sensor based on aninductive-capacitive resonant circuit, and its application for in situ monitoring of thequality of dry, packaged food such as cereals, and fried and baked snacks. The sensor ismade of a planar inductor and capacitor printe...
Main Authors: | Keat Ghee Ong, Brandon D. Pereles, Ranyuan Shao, Wen Ni Ng, Ee Lim Tan |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2007-09-01
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Series: | Sensors |
Subjects: | |
Online Access: | http://www.mdpi.com/1424-8220/7/9/1747/ |
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